Highly uniform gan film grown on sapphire substrate and its preparation method and application
A sapphire substrate, uniform technology, used in climate sustainability, final product manufacturing, sustainable manufacturing/processing, etc., can solve the problem of high cost, difficulty in preparing high uniformity GaN thin films, and low LED luminous efficiency and other problems, to achieve the effect of improving utilization, repeatability, and unique growth process
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Embodiment 1
[0031] combine Figure 1-3 . A GaN film grown on a sapphire substrate (see attached figure 1 ), including those grown on Al 2 o 3 The substrate (11) and its (0001) plane are 0.2° away from the (10-10) plane (the crystal epitaxial orientation relationship is: the (0001) plane of GaN is parallel to the Al 2 o 3 The (0001) plane) is used as the AlN nucleation layer (12) on the crystal epitaxial growth, and the GaN thin film (13) is grown on the AlN nucleation layer (12). The thickness of the AlN nucleation layer (12) is 8nm, the thickness of the GaN thin film (13) is 180nm, and the unevenness is 2.20%.
[0032] The preparation method of the GaN thin film grown on the sapphire substrate of the present embodiment is made by the following steps:
[0033] a. Al 2 o 3 The substrate is cleaned and annealed; the specific process of the annealing is: the substrate is placed in the annealing chamber, and the Al 2 o 3 The substrate is annealed for 1 hour; the cleaning is specific...
Embodiment 2
[0044] This embodiment is carried out on the basis of embodiment 1, the difference is that: the thickness of the AlN nucleation layer (12) is 10nm, the thickness of the GaN thin film (13) is 100nm, and the non-uniformity is 2.94 %.
Embodiment 3
[0046] This embodiment is carried out on the basis of embodiment 1, the difference is that: the thickness of the AlN nucleation layer (12) is 5nm, the thickness of the GaN thin film (13) is 200nm, and the non-uniformity is 2.47 %.
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Abstract
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