Upward punching die for case sideboard
A chassis and side plate technology, applied in the field of stamping processing, can solve the problems of poor blanking, high cost, and high defect rate, and achieve the effect of improving punching yield, avoiding scratches or scratches, and ensuring surface quality.
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[0020] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.
[0021] like figure 1 Shown is a schematic structural view of the chassis side plate to be processed in the present invention. In this embodiment, it is necessary to punch upward at the hole 1001 to be punched. like Figures 2 to 4 Shown is a structural schematic diagram of the upward punching die used for the side plate of the chassis of the present invention.
[0022] Specifically, an upward punching die for a side plate of a chassis includes an upper die and a lower die correspondingly arranged below the upper die, the upper die includes an upper die base 3, an upper clamping plate 4, an upper die base from top to bottom Template 5, upper mold base 3, upper splint 4 are connected with upper template 5 in turn, upper template 5 is provided with a stripping plate 6; lower mold includes lower mold...
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