Growth type polycrystalline diamond sintered assembly and application thereof
A polycrystalline diamond and diamond powder technology, which is applied in the field of superhard materials, can solve the problems that the diamond layer cannot be sintered, and achieve the effects of uniform residual stress distribution, optimized sintering environment, and good synthesis repeatability
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0032] Such as image 3 As shown, in this embodiment, the sintering assembly used includes a heating tube 31 , a metal adhesive layer 32 , a diamond layer 33 , an insulating tube 34 , and an infiltration cavity 35 .
[0033] In an implementation manner of this embodiment, the heating tube 31 is cylindrical, and the cylindrical heating tube 31 is located at the outermost layer of the sintered assembly. The height of the heating pipe is preferably selected at 1.2-10 cm. The outer diameter and height of the heating tube depend on the high-pressure space provided by the high-pressure equipment, and the heating tube can be enlarged correspondingly if the space is large. The wall thickness of the heating tube 31 is selected to be between 0.15-1 cm. The upper and lower ends of the heating pipe can be covered with several conductive heating sheets respectively, and the diameter of the sheets is equal to the outer diameter of the heating pipe.
[0034] The insulating tube 34 is loca...
PUM
Property | Measurement | Unit |
---|---|---|
height | aaaaa | aaaaa |
residual stress | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com