A kind of room temperature sintering method of nano-silver clad copper conductive ink

A technology of conductive ink and sintering method, which is applied in ink, household utensils, applications, etc., can solve the problems of limited substrate protection, and achieve the effects of large-scale production and simple process

Active Publication Date: 2020-09-22
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the fundamental principle is still heating and sintering, which has limited protection for the substrate and requires expensive equipment support

Method used

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  • A kind of room temperature sintering method of nano-silver clad copper conductive ink
  • A kind of room temperature sintering method of nano-silver clad copper conductive ink
  • A kind of room temperature sintering method of nano-silver clad copper conductive ink

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] (1) Disperse silver-coated copper nanoparticles with a diameter of 11nm (prepared according to ZL201611072652.1 method) in n-octane, prepare an ink with a solid content of 30w%, put it into an ultrasonic cleaner for 2 hours, and obtain a yellow-brown ink .

[0025] (2) Take an appropriate amount of ink on the polyethylene terephthalate (PET) film, and use the preparer to coat the film.

[0026] (3) Soak the film prepared in step (2) in a methanol solution of 10v% 1-amino-2-propanol for 1 min, and use alcohol amine to replace the oleylamine on the surface of the particles, so that the surface of the film changes from hydrophobic to Hydrophilic. Then wash with methanol 3 times and wipe dry.

[0027] (4) Repeat steps (2) and (3) for 3 coatings;

[0028] (5) Soak the film in step (4) in 2w% NaCl solution for 3 minutes, then wash it with water for 3 times, and dry it.

[0029] (6) The sheet resistance of the film measured by a four-probe tester is 10 Ω / □, the film thickn...

Embodiment 2

[0032] (1) Disperse silver-coated copper nanoparticles (ZL201611072652.1) with a diameter of 11nm in n-octane to prepare an ink with a solid content of 30w%, put it into an ultrasonic cleaner for 2 hours, and obtain a yellow-brown ink.

[0033] (2) Take an appropriate amount of ink on the polyethylene terephthalate (PET) film, and use the preparer to coat the film.

[0034] (3) Soak the film prepared in step (2) in a methanol solution of 10v% 1-amino-2-propanol for 1 min, and use alcohol amine to replace the oleylamine on the surface of the particles, so that the surface of the film changes from hydrophobic to Hydrophilic. Then wash with methanol 3 times and wipe dry.

[0035] (4) Repeat steps (2) and (3) for 2 coatings;

[0036] (5) Dissolving NaBH4 in NaOH solution with pH=12 to obtain NaBH4 solution with a mass fraction of 2w%.

[0037] (6) Soak the film of step (4) in the NaBH4 solution of step (5) for 3 minutes, then wash it with water for 3 times, and dry it.

[0038...

Embodiment 3

[0042] (1) Disperse silver-coated copper nanoparticles (ZL201611072652.1) with a diameter of 11nm in n-octane to prepare an ink with a solid content of 30w%, put it into an ultrasonic cleaner for 2 hours, and obtain a yellow-brown ink.

[0043] (2) Take an appropriate amount of ink on the PET film, and use the preparer to coat the film.

[0044] (3) Soak the film prepared in step (2) in a methanol solution of 10v% 1-amino-2-propanol for 1 min, and use alcohol amine to replace the oleylamine on the surface of the particles, so that the surface of the film changes from hydrophobic to Hydrophilic. Then wash with methanol 3 times and wipe dry.

[0045] (4) Repeat steps (2) and (3) for 3 coatings;

[0046] (5) Dissolving NaBH4 in NaOH solution with pH=12 to obtain NaBH4 solution with a mass fraction of 2w%.

[0047] (6) Soak the film of step (4) in the NaBH4 solution of step (5) for 2 minutes, then wash it with water for 3 times, and dry it.

[0048] (7) The sheet resistance of...

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Abstract

The invention discloses a room temperature sintering method of nano silver-coated copper conductive ink, belonging to the field of conductive ink. The method comprises the following steps: a, printingink on a flexible film substrate with a printer, a film coating machine, or the like or coating a flexible film substrate with ink with a printer, a film coating machine, or the like; b, soaking thefilm of the step a in 0-50 v% of an alcohol amine solution for 0-1h, and then conducting washing for 2-4 times with a hydrophilic solvent, and conducting wiping to be dry; c, repeating the steps a andb for repeat printing or coating to achieve the required print layer thickness; and d, soaking the film of the step c in 0-40w% of a reducing agent solution for 0-30 min, then conducting washing withwater for 2-4 times, and conducting wiping to be dry. The metal thin layer prepared by the chemical sintering method has low resistivity, the sintering of the nanometer copper-coated silver ink in room temperature air is realized, and the method can be used for various heat-sensitive and flexible substrates.

Description

technical field [0001] The invention belongs to the field of conductive ink, and in particular relates to a room temperature sintering method of nano silver-coated copper conductive ink. Background technique [0002] In recent years, metal nanomaterials in electronic functional materials have the characteristics of easy and flexible connection, easy to achieve low-temperature sintering, and active chemical properties, and have gradually become a research hotspot in the field of microelectronics. Among them, nano silver-coated copper not only maintains the high conductivity of copper and silver, but also can reduce the oxidation of copper and the electromigration of silver, so it is an ideal conductive filler. However, stabilizers on the surface of the nanoparticles prevent the formation of conductive pathways between the particles. Therefore, it is necessary to carry out subsequent sintering treatment on the printed pattern. [0003] At present, most of the sintering of na...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D11/52
CPCC09D11/52
Inventor 王涛戴小凤
Owner TSINGHUA UNIV
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