Water-cooled backing plate heat exchanger and performance test system thereof

A backplate heat exchanger technology, applied in the field of water-cooled backplate heat exchangers and their performance testing systems, can solve problems such as heat dissipation in computer rooms that are difficult to solve, and achieve the effects of strengthening disturbance, improving heat dissipation efficiency, and improving heat transfer coefficient

Inactive Publication Date: 2014-09-17
BEIJING INST OF SPACECRAFT SYST ENG
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

It is difficult to solve the heat dissipation problem of the computer room only by the air conditioning system. Other auxiliary cooling methods must be adopted to solve the cooling problem of high heat

Method used

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  • Water-cooled backing plate heat exchanger and performance test system thereof
  • Water-cooled backing plate heat exchanger and performance test system thereof
  • Water-cooled backing plate heat exchanger and performance test system thereof

Examples

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Embodiment Construction

[0016] The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0017] This embodiment provides a water-cooled backplane radiator and its performance testing system. The heat exchanger is used in the heat dissipation of server cabinets, which can effectively improve the heat dissipation efficiency of the data center and solve the cooling problem of high heat density servers.

[0018] The backplate radiator is a tube-fin type gas-liquid heat exchanger, and its structure is as follows: figure 1 As shown, it includes a back panel cold door 4, a back panel frame 3, a heat exchange tube 1, a fin 2, a water inlet main pipe 5 and a water outlet main pipe 6. The heat exchange tube 1 is a copper tube with a large heat transfer coefficient, and the fin 2 is made of an aluminum material with good heat conduction. At the same time, the fins adopt louver-type fins with better heat transfer performance, the thickness of the fins is...

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Abstract

The invention discloses a water-cooled backing plate heat exchanger and a performance test system thereof. The water-cooled backing plate heat exchanger comprises a water-cooled backing plate door, a backing plate frame, a heat exchanger, fins, a water inlet manifold and a water outlet manifold; cooling water enters paths of heat exchange pipes through the water inlet manifold to absorb air heat of the flow across fins when the backing plate heat exchanger works, and leaves the backing plate heat exchanger after being collected by the water outlet manifold. Hot air flow can reach the lower temperature level after passing through the backing plate heat exchanger. The heat exchanger is applicable to heat dissipation of a server cabinet, and can effectively improve the heat dissipation efficiency of a data room, and solves the refrigeration problem of a high-heat density server. The performance test system can determine the heat exchange performance of the heat exchanger effectively, and provides a reliable experimental basis for late optimization.

Description

technical field [0001] The invention relates to a heat exchanger and its testing system, in particular to a water-cooled backplate heat exchanger and its performance testing system. Background technique [0002] With the continuous improvement of social informatization, the demand for data centers has increased, and the power density of data centers has also increased rapidly. The survey results show that the power density of the computer room increased by nearly 15% in 2005, and the power of a single rack increased from the initial 1kW to 12kW, showing an increasing trend. The heat dissipation of the computer room continues to increase at an alarming rate with the increase of power density, so it is of great significance to strengthen the heat dissipation of the data computer room. [0003] The cooling system of most data centers in operation today is based on the early traditional cooling design: only considering the purpose of cooling the server by reducing the temperatu...

Claims

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Application Information

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IPC IPC(8): G06F1/20G01M99/00
Inventor 孙鹏赵欣苗建印黄金印刘庆志魏然
Owner BEIJING INST OF SPACECRAFT SYST ENG
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