Check patentability & draft patents in minutes with Patsnap Eureka AI!

Heat-dissipating device

A technology of heat dissipation device and heat dissipation body, which is applied in the direction of electrical components, electric solid devices, circuits, etc., and can solve the problems of electronic components such as elevation and damage

Inactive Publication Date: 2014-09-17
JUN ZHAN TECH
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the electronic product is in operation, the current in the circuit will generate unnecessary heat energy due to the influence of impedance. If the heat energy cannot be effectively removed and accumulated on the electronic components inside the electronic product, the electronic components may be due to rising damage due to temperature

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat-dissipating device
  • Heat-dissipating device
  • Heat-dissipating device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0042] Please refer to Figure 1 to Figure 4 , figure 1 is a perspective view of a heat sink 1 according to an embodiment of the present invention, figure 2 yes figure 1 A perspective view of the heat sink 1 in another perspective, image 3 yes figure 1 The bottom view of the heat sink 1 in, Figure 4 yes image 3 The sectional view of the heat sink 1 along the line A-A in . Such as Figure 2 to Figure 4 As shown, the heat sink 1 is used to dissipate heat from the heat source 2 . The heat source 2 can be a light emitting diode, an integrated circuit chip or other semiconductor components that generate heat during operation.

[0043] Such as Figure 1 to Figure 4 As shown, the heat dissipation device 1 includes a heat dissipation body 10 and a plurality of extension parts 12,

[0044] The heat source 2 is disposed on the heat-absorbing end 100 of the heat dissipation body 10 . The extension portion 12 radially extends from the surrounding of the heat dissipation bod...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a heat-dissipating device which is used for dissipating the heat of a heat source. The heat-dissipating device comprises a heat-dissipating body and a plurality of extension portions. The heat source is arranged on the heat absorption end of the heat-dissipating body. The extension portions extend from the heat-dissipating body in a radial manner; the extension portions have a plurality of gaps; and the heat-dissipating body is not overlapped with the gaps in the direction vertical to the heat source. Since the extension portions extend from the heat-dissipating body in the radial manner, cold air around the heat-dissipating device can contact the heat-dissipating body directly to carry out heat exchange, and blocking or obstruction due to the design of the extension portions are not caused. Besides, since the heat-dissipating body is not overlapped with the gaps between the extension portions in the direction vertical to the heat source, hot air at the heat source can perfectly flow upwards via the gaps between the extension portions to form nature thermal convection, that is, the thermal convection does not weaken due to the blocking of any part of the heat-dissipating body.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device with high heat dissipation efficiency. Background technique [0002] Heat sinks are closely related to the development of electronic products. When the electronic product is in operation, the current in the circuit will generate unnecessary heat energy due to the influence of impedance. If the heat energy cannot be effectively removed and accumulated on the electronic components inside the electronic product, the electronic components may be due to rising temperature can cause damage. Therefore, the quality of the cooling device greatly affects the operation of electronic products. Taking light emitting diodes (light emitting diodes, LEDs) as an example, as the luminous brightness of the LEDs continues to increase, the heat generated when the LEDs emit light also increases synchronously. In addition, LEDs are usually densely arranged in lighting devices to...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/367
Inventor 施权峰傅圣文吴炫达赖志铭郭钟亮
Owner JUN ZHAN TECH
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com