Radio frequency module

A radio frequency module and radio frequency identification technology, applied in the field of radio frequency identification, can solve the problems of low production efficiency and large area occupied by radio frequency modules

Active Publication Date: 2014-10-08
NANTONG FUJITSU MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the radio frequency module formed by the prior art occupies a large area and has low manufacturing efficiency

Method used

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Experimental program
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Effect test

Embodiment Construction

[0037] As mentioned in the background, the radio frequency module formed in the prior art occupies a relatively large area and has low manufacturing efficiency.

[0038] After research, in the existing technology, when forming a radio frequency module, the radio frequency identification antenna and the radio frequency integrated chip are manufactured separately. The metal connection wire is formed by the bonding process to electrically connect a single RFID antenna and the RF integrated chip to form a radio frequency module, which reduces the production efficiency, and the RFID antenna and the RF integrated chip need to be pasted on the carrier board and then electrically connected by a metal wire, so that the formed The radio frequency module occupies a relatively large area and volume.

[0039] After further research, the radio frequency identification antenna needs to meet a certain length when used and designed, so the size of the radio frequency identification antenna is ...

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PUM

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Abstract

The invention discloses a radio frequency module. The radio frequency module comprises a carrier plate, radio frequency integrated chips, a first plastic packaging layer and a radio frequency identification antenna. The carrier plate comprises a plurality of chip areas and cutting channel areas, the radio frequency integrated chips are attached to the chip areas of the carrier plate, each radio frequency integrated chip comprises a first bonding pad and a second bonding pad, the surfaces of the radio frequency integrated chips and the surface of the carrier plate are covered with the first plastic packaging layer, the first plastic packaging layer is provided with a first metal column electrically connected with the first bonding pads and a second metal column electrically connected with the second bonding pads, the first metal column and the second metal column are exposed out of the first plastic packaging layer, the radio frequency identification antenna is located on the first plastic packaging layer and comprises a first end and a second end, the radio frequency identification antenna extends from the first end to the second end, the first end is electrically connected with the first metal column, and the second end is electrically connected with the second metal column. The radio frequency model is small in occupation area and volume.

Description

technical field [0001] The invention relates to radio frequency identification technology, in particular to a radio frequency module. Background technique [0002] RFID (Radio Frequency Identification: Radio Frequency Identification) is a non-contact automatic identification technology, which automatically identifies the target object and obtains relevant data through radio frequency signals, and the identification work does not require manual intervention. [0003] The basic RFID system consists of two parts: a reader (Reader) and a transponder (Transponder). The transponder is also called a radio frequency module. The transponder (Transponder): consists of a radio frequency identification antenna and a radio frequency integrated chip. [0004] The working principle of the RFID system is: the reader transmits a specific frequency signal to the transponder (Transponder), which is used to drive the internal circuit in the transponder (Transponder) to send the internal data, o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31G06K19/077H01Q1/22H01L21/98
CPCH01L2223/6677H01L2224/04105H01L2224/12105H01L2224/19H01L2224/32225H01L2224/73267H01L2224/92244
Inventor 石磊
Owner NANTONG FUJITSU MICROELECTRONICS
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