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A multi-channel substrate integrated waveguide power splitter

A technology of integrating waveguide and power divider, which is applied in the direction of waveguide devices, circuits, electrical components, etc., can solve the problems of power divider size increase and large insertion loss, etc., achieve small insertion loss, realize broadband work, easy design and Processing effect

Active Publication Date: 2016-11-02
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional probe-fed substrate-integrated waveguide power divider is difficult to integrate with the planar circuit, and the insertion loss of the T / Y-section substrate-integrated waveguide power divider is too large, and with the increase of the number of output ports, the power divider’s a dramatic increase in size

Method used

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  • A multi-channel substrate integrated waveguide power splitter
  • A multi-channel substrate integrated waveguide power splitter
  • A multi-channel substrate integrated waveguide power splitter

Examples

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Embodiment Construction

[0019] Below in conjunction with specific embodiment, further illustrate the present invention, should be understood that these embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention, after having read the present invention, those skilled in the art will understand various equivalent forms of the present invention All modifications fall within the scope defined by the appended claims of the present application.

[0020] Such as figure 1 As shown, the multi-channel substrate integrated waveguide power splitter includes three dielectric substrates, four metal layers, rectangular metallized through-hole arrays, microstrip lines and feeding probes; three dielectric substrates and four metal layers are stacked The splitter body is formed by pressing, and the three-layer dielectric substrates are respectively the first layer substrate 4, the second layer substrate 5 and the third layer substrate 6; the four-laye...

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Abstract

The invention discloses a multi-channel substrate integrated waveguide power divider, which comprises a three-layer dielectric substrate and four layers of metal respectively located on the upper surface of the uppermost substrate, the lower surface of the lowermost substrate and between the substrates. A rectangular metallized through-hole array and two layers of intermediate metal between the substrates constitute a rectangular resonant cavity. The left side of the rectangular resonator is the input port, and the right side is the output port. It can be flexibly designed as a 1-to-4 dual non-inverting and dual-inverting power splitter; and a 1-to-2 non-inverting or inverting power splitter. The invention has the advantages of wide band, low insertion loss, good standing wave ratio of input voltage, good amplitude consistency of each output signal, low amplitude unbalance and the like. The invention can be applied to microwave and millimeter wave antenna feeding networks, etc., and has wide application prospects in microwave and millimeter wave systems such as communication and radar.

Description

technical field [0001] The invention relates to a multi-layer low insertion loss and broadband substrate integrated waveguide power divider, which belongs to the field of microwave passive devices. Background technique [0002] The power splitter is a key component of the power combining amplifier and antenna array feeding system, which determines the system performance. With the rapid development of communication systems, the demand for broadband, low insertion loss, and high-efficiency power dividers is increasing day by day. The traditional probe-fed substrate-integrated waveguide power divider is difficult to integrate with the planar circuit, and the insertion loss of the T / Y-section substrate-integrated waveguide power divider is too large, and with the increase of the number of output ports, the power divider’s The size increases dramatically. Therefore, broadband, low insertion loss, multi-channel power splitters are urgently needed. Contents of the invention ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P5/12
Inventor 王海明张小伟无奇余晨洪伟
Owner SOUTHEAST UNIV
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