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Silicon substrate microphone encapsulation method

An encapsulation method and microphone technology, applied in the field of microphones, can solve the problems such as the 18' of the waterproof material is easy to fall off, the frequency response of the microphone is distorted, and the sound transmission effect is affected, and the effect of good dustproof effect, simplified packaging process and cost reduction can be achieved.

Inactive Publication Date: 2014-10-22
AAC ACOUSTIC TECH (SHENZHEN) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The MEMS microphone 100' of the related art relies on a layer of waterproof material 18' attached to the upper surface of the upper cover 20' for waterproof and dustproof, but this way of attachment is not firm, and the waterproof material 18' will It is easy to fall off. Moreover, the waterproof material 18' is attached to the upper surface of the upper cover 20', which will affect the effect of sound transmission and cause distortion of the frequency response of the microphone.

Method used

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  • Silicon substrate microphone encapsulation method
  • Silicon substrate microphone encapsulation method
  • Silicon substrate microphone encapsulation method

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Embodiment Construction

[0027] The specific content of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0028] The silicon-based microphone 100 of the present invention can be used in mobile phones or other electronic devices to receive acoustic signals and convert the acoustic signals into electrical signals.

[0029] Please refer to figure 2 As shown, the silicon-based microphone 100 of the present invention mainly includes a housing 1, a circuit board 2 assembled with the housing 1 and forming an accommodation space, a transducer 3 arranged in the accommodation space, and a transducer 3 arranged in the accommodation space and connected to the transducer 3 integrated chips 4 electrically connected. The casing 1 includes a metal strip 10 and a composite material 11 bonded to the metal strip 10, and the composite material 11 is provided with a number of micropores 50 (see Figure 5 ), the metal strip 10 is provided with a sound inlet hole 12....

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Abstract

The invention provides a silicon substrate microphone encapsulation method. The silicon substrate microphone encapsulation method comprises the following steps of providing a metal material strip; punching the metal material strip for form a tone entering hole; providing composite materials which comprise a plurality of micropores; enabling the metal material strip to be attached to the composite materials to form a combination body; performing stamping forming on the combination body to form a housing; providing a circuit board, an energy transducer and an integrated chip; enabling the energy transducer and the integrated chip to be arranged on the circuit board or the housing; enabling the circuit board to be in assembly connection with the housing to form an accommodating space. According to the silicon substrate microphone encapsulation method, the waterproof and dustproof effect can be achieved, meanwhile the energy transducer and the integrated chip which are arranged in a microphone can be effectively protected, and the high-frequency response of the microphone can be effectively inhibited, the encapsulation process is simplified, and accordingly the cost is further reduced.

Description

【Technical field】 [0001] The invention relates to a microphone, in particular to a silicon-based microphone packaging method. 【Background technique】 [0002] With the development of wireless communication, there are more and more mobile phone users around the world. The requirements of users for mobile phones are not only satisfied with calls, but also to be able to provide high-quality call effects. Especially the current development of mobile multimedia technology, the mobile phone Call quality is more important. The microphone of a mobile phone is used as a voice pick-up device for the mobile phone, and its design directly affects the call quality. [0003] Currently, silicon-based microphones, which are widely used and have better performance, are also called MEMS (Micro-Electro-Mechanical-System Microphone) microphones in the industry. MEMS microphone is a microphone based on MEMS technology. Simply put, a capacitor is integrated on a micro-silicon chip. It can be manu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R31/00
Inventor 吴志江
Owner AAC ACOUSTIC TECH (SHENZHEN) CO LTD