Silicon substrate microphone encapsulation method
An encapsulation method and microphone technology, applied in the field of microphones, can solve the problems such as the 18' of the waterproof material is easy to fall off, the frequency response of the microphone is distorted, and the sound transmission effect is affected, and the effect of good dustproof effect, simplified packaging process and cost reduction can be achieved.
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[0027] The specific content of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0028] The silicon-based microphone 100 of the present invention can be used in mobile phones or other electronic devices to receive acoustic signals and convert the acoustic signals into electrical signals.
[0029] Please refer to figure 2 As shown, the silicon-based microphone 100 of the present invention mainly includes a housing 1, a circuit board 2 assembled with the housing 1 and forming an accommodation space, a transducer 3 arranged in the accommodation space, and a transducer 3 arranged in the accommodation space and connected to the transducer 3 integrated chips 4 electrically connected. The casing 1 includes a metal strip 10 and a composite material 11 bonded to the metal strip 10, and the composite material 11 is provided with a number of micropores 50 (see Figure 5 ), the metal strip 10 is provided with a sound inlet hole 12....
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