A flexible circuit board electroplating composite hanger

Abstract

The invention relates to a composite hanger for electroplating of a flexible circuit board. The composite hanger comprises a first clamping member and a second clamping member which are arranged lengthways, wherein the first clamping member comprises a first fixing member integrated with a first hanging handle; the second clamping member comprises a second fixing member integrated with a second hanging handle; first pressing members and second pressing members can be rotationally arranged on the first fixing member and the second fixing member respectively in a pressed manner; when pressed together, the first fixing member and the first pressing members can be clamped tightly by first opening clamps; first fixing member conducting plates and first pressing member conducting plates are fixed on the opposite surfaces of the first fixing member and the first pressing members respectively; second fixing member conducting plates and second pressing member conducting plates are fixed on the opposite surfaces of the second fixing member and the second pressing members respectively. The composite hanger adopts an open-close type clamping plate structure so that base materials are convenient and fast to take down, wrinkles cannot be produced, and the product scrappage is lowered; the double-side large-area conducting plates are adopted, the conducting area is increased, and uniform plating thickness is ensured.

Description

technical field [0001] The invention relates to a hanger used for electroplating of flexible circuit boards. Background technique [0002] Flexible printed circuit boards, also known as flexible printed circuit boards, are products designed and produced with circuit graphics on flexible substrates by way of printing. After the flexible circuit board is drilled, different layers need to be connected by electroplating metal copper in the through hole. A layer of ion target is adsorbed on the wall of the through hole of the substrate, and a metal copper layer is deposited on the substrate that has been adsorbed to the ion target by catalyzing the redox reaction. When sinking copper, the substrate needs to be fixed by a hanger or a hanging basket, and then immersed. In the prior art, when the base material is fixed by the hanger, the base material is fixed by the fastening screw, and the electrical connection is made through the screw fixing point, the conductive area is small...

AI Technical Summary

Problems solved by technology

In the prior art, when the base material is fixed by the hanger, the base material is fixed by the fastening screw, and the electrical connection is made through the screw fixing point, the conductive area is small, and the thickness of the coating is uneven, resulting in many open and short circuits, and the upper and lower splints Inconvenient, easy to wrinkle, resulting in scrap

Images