MEMS (micro electro mechanical system) silica-based micro-hotplate provided with thermal insulation channels and processing method of MEMS silica-based micro-hotplate

A processing method and a technology of a micro-hot plate, which are applied in the process, micro-structure technology, micro-structure device and other directions for producing decorative surface effects, can solve the problems of poor heat insulation effect, influence of heat insulation effect, and rapid heat loss, etc. Achieve the effect of preventing cracks, avoiding damage to the micro-hot plate, and improving service life

Inactive Publication Date: 2014-12-03
SUZHOU LEANSTAR ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] (2) The heat insulation effect is poor, and the air gap between the heat insulation tanks is large, resulting in faster heat loss, which affects the heat insulation effect

Method used

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  • MEMS (micro electro mechanical system) silica-based micro-hotplate provided with thermal insulation channels and processing method of MEMS silica-based micro-hotplate
  • MEMS (micro electro mechanical system) silica-based micro-hotplate provided with thermal insulation channels and processing method of MEMS silica-based micro-hotplate
  • MEMS (micro electro mechanical system) silica-based micro-hotplate provided with thermal insulation channels and processing method of MEMS silica-based micro-hotplate

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] See figure 1 , figure 2 , Embodiment 1 of the present invention discloses a MEMS silicon-based micro-hot plate with thermal insulation grooves, comprising: a single crystal silicon substrate 1; a thermal insulation groove 2 formed on the upper surface of the single crystal silicon substrate 1 and With a certain depth, the thermal insulation groove 2 includes one or more groups of grooves, wherein each group of grooves includes a plurality of linear grooves arranged in parallel; the lower insulating layer 3 covers the thermal insulation groove 2 and the single crystal silicon The upper surface of the substrate 1; the heating layer 4 is arranged on the upper surface of the lower insulating layer 3, and the heating layer 4 is located in the area directly above the heat insulating trench 2; the upper insulating layer 5 covers the The upper surface of layer 4 is heated.

[0052] The heating layer 4 of the present invention is located in the area directly above the heat-in...

Embodiment 2

[0091] See figure 1 , image 3 , Embodiment 2 of the present invention discloses a MEMS silicon-based micro-hot plate with thermal insulation grooves, comprising: a single crystal silicon substrate 1; a thermal insulation groove 2 formed on the upper surface of the single crystal silicon substrate 1 and With a certain depth, the thermal insulation groove 2 includes one or more groups of grooves, wherein each group of grooves includes a plurality of linear grooves arranged in parallel; the lower insulating layer 3 covers the thermal insulation groove 2 and the single crystal silicon The upper surface of the substrate 1; the heating layer 4 is arranged on the upper surface of the lower insulating layer 3, and the heating layer 4 is located in the area directly above the heat insulating trench 2; the upper insulating layer 5 covers the The upper surface of layer 4 is heated.

[0092] The heating layer 4 of the present invention is located in the area directly above the heat-ins...

Embodiment 3

[0131] See figure 1 , Figure 4 , Embodiment 3 of the present invention discloses a MEMS silicon-based micro-hot plate with thermal insulation grooves, comprising: a single crystal silicon substrate 1; a thermal insulation groove 2 formed on the upper surface of the single crystal silicon substrate 1 and With a certain depth, the thermal insulation groove 2 includes one or more groups of grooves, wherein each group of grooves includes a plurality of linear grooves arranged in parallel; the lower insulating layer 3 covers the thermal insulation groove 2 and the single crystal silicon The upper surface of the substrate 1; the heating layer 4 is arranged on the upper surface of the lower insulating layer 3, and the heating layer 4 is located in the area directly above the heat insulating trench 2; the upper insulating layer 5 covers the The upper surface of layer 4 is heated.

[0132] The heating layer 4 of the present invention is located in the area directly above the heat-in...

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Abstract

The invention relates to the field of silica-based micro-hotplates, and discloses an MEMS (micro electro mechanical system) silica-based micro-hotplate provided with thermal insulation channels and a processing method of the MEMS silica-based micro-hotplate. The MEMS silica-based micro-hotplate comprises a monocrystal silicon substrate, the thermal insulation channels, a lower insulation layer, a heating layer and an upper insulation layer, wherein one or more groups of thermal insulation channels with certain depths are formed in the upper surface of the monocrystal silicon substrate, and each group of channels comprises a plurality of parallel straight channels; the thermal insulation channels and the upper surface of the monocrystal silicon substrate are covered with the lower insulation layer; and the heating layer and the upper insulation layer are arranged above the lower insulation layer. According to the micro-hotplate, a film on the lower insulation layer as well as the heating layer and the upper insulation layer above the film on the lower insulation layer can be stably supported by the thermal insulation channels, and the heating layer is prevented from falling off due to the fact that the lower insulation layer deforms and warps during high-temperature work of a device; and meanwhile, the surfaces of the thermal insulation channels are covered with the silicon dioxide film, the silicon dioxide film can have a better thermal insulation effect, the detection sensitivity of the micro-hotplate is increased, and the service life is prolonged.

Description

technical field [0001] The invention relates to a silicon-based micro-hot plate, in particular to a MEMS silicon-based micro-hot plate with heat-insulating grooves and a processing method thereof. Background technique [0002] A micro-hotplate is a common heating platform used to heat a component on it to keep the component at the desired operating temperature. At present, silicon-based micro-hotplates have been widely used in micro-devices such as micro-gas sensors, thin-film calorimeters, micro-accelerometers, and barometers. The basic structure of a micro-hotplate includes a suspended dielectric film and thin-film resistor strips. When the current passes through the thin-film resistor strip, part of the Joule heat generated by the resistance is used to heat the micro-hotplate, and the other part is dissipated in the surrounding environment by conduction, convection and radiation. [0003] Micro-hotplates based on silicon micromachining technology are made by micro-proce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/02B81C1/00
Inventor 沈方平张珽祁明锋刘瑞丁海燕谷文
Owner SUZHOU LEANSTAR ELECTRONICS TECH
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