Silicon rod sticking improving process

A silicon rod and process technology, applied in the field of improving the process and quality of viscose silicon rods, can solve the problems such as the inability to observe pores, achieve the effects of reducing curing time, quality assurance, and improving work capacity

Inactive Publication Date: 2014-12-10
无锡尚品太阳能电力科技有限公司
View PDF8 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, it is impossible to observe whether there are air holes in the bonding of the ingot and the glass. If there are air ho

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0023] Example 1

[0024] (1) Select the silicon rod with a length of 250-300mm, and wipe the surface of the crystal rod clean with alcohol, free of dust and debris.

[0025] (2) Choose frosted glass consistent with the specifications of the crystal bar, and wipe the surface of the frosted glass clean with alcohol without dust and debris.

[0026] (3) The wiped crystal rod is wrapped with masking tape on the chamfer to prevent the glue from leaking.

[0027] (4) Spread the glue evenly on the surface of the silicon rod. After the glue is applied, press the wiped frosted glass surface on the surface of the crystal rod, use glue to bond the crystal rod and the frosted glass together, and use the weight of the crystal rod as (35-40kg) for extrusion, curing time is 6h.

[0028] (5) After the crystal rod and frosted glass are cured, wipe the side of the glass without glue with alcohol and toilet paper. If the glue on the crystal rod and the glass bonding surface is not evenly applied, the po...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a silicon rod sticking improving process belonging to the technical field of silicon rod cutting. The silicon rod sticking improving process comprises the steps of uniformly smearing glue (epoxy glue) on the surface of a crystal rod, and then, pressing ground glass on the crystal rod to ensure that whether air bubbles are generated on the glass can be directly seen after the glass is stuck; if no air bubbles are generated, continuing to stick the glass to a workpiece plate; and if air bubbles are generated, directly separating in water with the high temperature of 100 DEG C. By using the silicon rod sticking improving process, the time consumed by using the traditional sticking process is shortened, the quality problem of edge breakage caused when the silicon rod is processed is reduced, and the risks of overhigh single battery piece cost caused by silver paste leakage from an edge breakage position when silicon wafers are put into production of battery pieces and relatively short service life of silk screen printing equipment are also reduced.

Description

technical field [0001] The invention relates to a process for improving viscose silicon rods, in particular to a process for saving energy and reducing consumption while improving the quality of chipping on the surface of silicon wafers, and belongs to the technical field of silicon rod cutting. Background technique [0002] The existing method of sticking silicon rods is to first glue the frosted glass on the workpiece plate with glue (epoxy glue), and cure for half an hour; after it is completely fixed, fix the crystal rod on the glass with epoxy glue; after complete curing Cutting on the machine. In this way, it is impossible to observe whether there are air holes in the bonding of the ingot and the glass. If there are air holes, the glue will act as a buffer, resulting in a large number of chipping after the silicon ingot is sliced. Stick surface friction. Contents of the invention [0003] The object of the present invention is to aim at the deficiencies in the prio...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C30B33/00B28D5/00
Inventor 杜正兴李靖华冰
Owner 无锡尚品太阳能电力科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products