Light-emitting diode (LED) full-color chip on board (COB) mode packaging method

A packaging method and LED chip technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of high light requirements for ambient lighting, the inability to achieve standard resolution splicing of the entire screen resolution, and small viewing angles. Uneven light emission, ultra-high-definition display effect, and improved moisture-proof performance
CN104201272AInactive Publication Date: 2014-12-10SHENZHEN JINGTAI
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHENZHEN JINGTAI
Publication Date
2014-12-10
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a light-emitting diode (LED) full-color chip on board (COB) mode packaging method. The LED full-color COB mode packaging method is characterized in that the LED full-color COB mode packaging method comprises a substrate, a circuit arranged on the substrate, LED light emitting chips, and a packaging glue for the LED light emitting chips, wherein the circuit comprises a front surface circuit arranged on the upper surface of the substrate and a back surface circuit arranged on the back surface of the substrate, and the LED light emitting chips are placed on the front surface circuit; the LED full-color COB mode packaging method mainly includes the following steps of substrate cleaning, die bonding primer unfreezing, uniform expansion of distances among the LED chips, attachment of the LED chips to the substrate through a die bonder and a die bonding primer, connection of the LED chips attached to the substrate with a bonding pad on the substrate through a bonding wire and a welding wire machine, and compression molding of a packaging glue and the front surface of the substrate through a die manufacturing machine under a high temperature to protect the LED chips on the substrate. According to the LED full-color COB mode packaging method, the problem of uneven light emitting caused by a light mixing phenomenon existing after an application end is lighted in original COB packaging processes is solved, so that reliability and property of an indoor display screen can be improved, service life of the indoor display screen is prolonged, and the method is further application to outdoor display screens.
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Description

technical field

[0001] The invention relates to the technical field of LED packaging, and more specifically relates to a packaging method of LED full-color COB mode. Background technique

[0002] With the continuous improvement of indoor display application technology, the currently used display application products such as projection / DLP / LCD / PDP cannot fully meet the market application requirements. There are also some defects in various aspects so that it cannot break through the development of technology.

[0003] The main defects of the current projection display: 1. The light point design of the front projection fusion splicing needs to be very precise. The geometry will change a lot, and professional re-calibration is required; 2. Rear projection fusion splicing needs to provide a large darkroom space, and front projection fusion splicing requires no people to walk in front of the screen to prevent blocking the projection light path; 3. Fusion belt "Eat" the pixels i...

Claims

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