Light-emitting diode (LED) full-color chip on board (COB) mode packaging method
A packaging method and LED chip technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of high light requirements for ambient lighting, the inability to achieve standard resolution splicing of the entire screen resolution, and small viewing angles. Uneven light emission, ultra-high-definition display effect, and improved moisture-proof performance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0031] The embodiment of the present invention discloses a packaging method of LED full-color COB mode, which specifically includes:
[0032] The substrate 1; the circuit circuit 2 arranged on the substrate 1, the circuit circuit 2 includes two parts: the front circuit circuit 21 arranged on the substrate 1 and the back circuit circuit 22 arranged on the bottom surface of the substrate 1; the circuit circuit 22 placed on the front circuit circuit 21 The LED li...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com