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Method for forming fluoride spray coating, and member coated with fluoride spray coating

A technology for covering parts and fluoride, which is applied in the direction of coating, fusion spraying, metal material coating process, etc., can solve problems such as quality reduction, and achieve the effect of excellent corrosion resistance

Active Publication Date: 2014-12-10
TOCALO & HANTAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, on the other hand, fine SiO stripped off by etching from the surface of the semiconductor material after plasma treatment (especially plasma etching treatment) 2 、Si 3 N 4 Particles such as , Si, and W float in the processing environment, and there is a problem that these particles adhere to the surface of the device during or after processing, resulting in a significant decrease in its quality

Method used

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  • Method for forming fluoride spray coating, and member coated with fluoride spray coating
  • Method for forming fluoride spray coating, and member coated with fluoride spray coating
  • Method for forming fluoride spray coating, and member coated with fluoride spray coating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0113] In this example, the influence of the pretreatment of the substrate surface on the adhesion of the fluoride spray coating was investigated.

[0114] (1) Types of pretreatment

[0115] The following pretreatment was performed on one side of Al3003 alloy ("JIS M4000", size: diameter 25 mm×thickness 5 mm) as a base material.

[0116] (i) After degreasing, lightly grind with a wire brush.

[0117] (ii) After degreasing, Ni-20 mass % Cr was formed into a metal undercoat layer with a thickness of 50 μm by an atmospheric plasma spraying method (flying speed: 250 m / s).

[0118] (iii) After degreasing, WC-12 mass % Co was sprayed sparsely (area ratio: 22%) using a high-speed flame spraying method (flight speed 580 m / s, number of spraying: 3 times) to form a primer part.

[0119] (iv) After degreasing, the Cr 3 C 2 -18 mass % Ni-7 mass % Cr An undercoat layer of carbide cermet with a thickness of 30 μm was formed by a high-speed flame spraying method (flight speed 560 m / s, nu...

Embodiment 2

[0138] In this example, the formation of YF with a thickness of 100 μm using SS400 steel as a base material and a reduced pressure plasma spraying method was investigated. 3 Adhesion of the spray coating when the coating is sprayed.

[0139] (1) Type of pretreatment (surface roughening, formation of intermediate layer)

[0140] The same kind of pretreatment method as in Example 1 was carried out.

[0141] (2) Formation of fluoride spray coating

[0142] YF with a thickness of 100 μm is formed by plasma spraying (decompression plasma spraying) in a reduced pressure environment of Ar gas of 100 to 200 hPa 3 .

[0143] (3) Adhesion test method of film

[0144] The same method as in Example 1 was carried out.

[0145] (4) Test results

[0146] The test results are shown in Table 2. From this result, it can be seen that YF is formed directly on the surface of the base material 3In the case of spray coating (No. 1), the adhesion force of the film formed after sandblasting wa...

Embodiment 3

[0154] In this example, YF formed by high-speed plasma spraying using SS400 steel as a base material is investigated 3 Adhesion of spray coating.

[0155] (1) Type of pretreatment (surface roughening, formation of intermediate layer)

[0156] The same pretreatment method as in Example 1 was carried out.

[0157] (2) Formation of fluoride spray coating

[0158] YF with a thickness of 100 μm is formed by high-speed plasma spraying 3 .

[0159] (3) Adhesion test method of film

[0160] It was implemented by the same method as Example 1.

[0161] (4) Test results

[0162] The test results are shown in Table 3. From this result, like the results of Example 1 and Example 2, it was confirmed that the primer part or primer layer (No. 3, 4, 7, 8) of the carbide cermet according to the present invention was formed with the substrate. Regardless of the presence or absence of surface roughening by sandblasting, a fluoride sprayed coating that often has high adhesion can be formed....

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Abstract

[Problem] To provide a member coated with a fluoride spray coating in which a surface of a substrate is coated with a carbide cermet, and a fluoride spray coating is made to strongly adhere by the interposition of the carbide cermet, and to provide a method for providing the member coated with a fluoride spray coating. [Solution] An outer coating layer or primer of a carbide cermet in which a film-shaped coating is formed while distal-end parts of carbide cermet particles are embedded in a substrate is formed on a surface of the substrate by blowing a carbide cermet material at high speed onto the surface of the substrate using a spray gun, and a fluoride spray coating is then formed by spraying fluoride particles thereon.

Description

technical field [0001] The present invention relates to a method for forming a fluoride spray coating and a fluoride spray coating covering member. In particular, the present invention proposes a method for forming a fluoride spray coating with carbide cermet on the surface of a semiconductor processing apparatus component etc. subjected to plasma etching in an environment of strong corrosive gas, and a method obtained by carrying out the method. The fluoride spray coating covers the parts. Background technique [0002] A spray coating is useful as a corrosion-resistant coating formed on the surface of a member for a semiconductor processing apparatus. For example, when the aforementioned parts are subjected to plasma treatment in the presence of halogens or halogen compounds, or when used in the field of semiconductor processing equipment that requires cleaning and removal of fine particles generated by plasma treatment, further surface treatment is required. Several exis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C4/12C23C4/02C23C4/04C23C4/06C23C4/10
CPCC23C4/06C23C4/04C23C4/10C23C4/12C23C4/02C23C4/129C23C4/134Y10T428/24413
Inventor 原田良夫户越健一郎
Owner TOCALO & HANTAI CO LTD
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