Semiconductor package and method for manufacturing same
A semiconductor and component technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problem of filling conductive substances in through holes, and achieve the effect of precision process defects
Inactive Publication Date: 2014-12-10
NEPES CO LTD
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Problems solved by technology
However, there are limitations that it is difficult to precisely form the through holes on the package model and to densely fill the conductive substances in the through holes.
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[0022] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention are provided in order to more completely describe the technical idea of the present invention to those skilled in the art. The following embodiments can be changed into various other ways, and the scope of the technical idea of the present invention is not limited to the following Rather, these embodiments make the disclosure of the present invention more substantial and complete, and are provided to fully convey the technical idea of the present invention to those skilled in the art. The term "and / or" as used in this specification includes any one and all combinations of more than one of the corresponding listed items. The same symbols always mean the same elements. In addition, various elements and areas in the drawings are schematically drawn. Therefore, the technical idea of the presen...
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The present invention provides a method for manufacturing a semiconductor package comprising connecting wiring which is precise and has a low defect rate in the manufacturing process. The method for manufacturing the semiconductor package, according to one embodiment of the present invention, comprises the steps of: preparing a conductive member; removing one portion of the conductive member to form a flat portion and a protruding portion, which protrudes from the flat portion; arranging the conductive member and a semiconductor chip, and forming a sealing member for sealing a semiconductor chip and the conductive member; exposing the protruding portion of the conductive member through the sealing member to form the connecting wiring; forming a rewiring pattern layer which electrically connects the connecting wiring and the semiconductor chip; and forming an external connection member which is electrically connected to the rewiring pattern layer.
Description
technical field [0001] The technical idea of the present invention relates to a semiconductor component, and more specifically, to a semiconductor component including through wiring and a manufacturing method thereof. Background technique [0002] In recent years, with the miniaturization of process technology and the diversification of functions of semiconductor components, the chip size has decreased, and with the increase in the number of output and input terminals, the electrode pad spacing has gradually become smaller. With the integration of various functions Acceleration, the system-in-package technology that integrates various components into one package is gradually emerging. In addition, in the system-in-package technology, in order to minimize the noise between operations and increase the signal speed, it is gradually changing to a three-dimensional stacking technology method that can maintain a short signal distance. On the other hand, in order to meet the dem...
Claims
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IPC IPC(8): H01L21/60H01L23/48
CPCH01L2225/1058H01L21/486H01L2221/68377H01L2224/215H01L2224/2101H01L23/49816H01L2225/1035H01L2224/211H01L25/105H01L23/49811H01L24/20H01L24/13H01L21/568H01L2221/68359H01L2224/12105H01L24/19H01L2221/68304H01L23/49822H01L21/6835H01L2224/131H01L2221/68368H01L2224/82106H01L23/5389H01L2224/19H01L2924/01029H01L2924/01013H01L2924/014H01L2924/181H01L2924/12042H01L2224/04105H01L2924/18162H01L2224/96H01L2924/00H01L23/48H01L23/12H01L21/02068H01L21/31053H01L21/32115H01L21/3213H01L21/768H01L23/5384H01L23/5386H01L25/0657H01L25/50
Inventor 苏赛贤萧元甄王传伟苏孝文陈浩洋
Owner NEPES CO LTD