Semiconductor component and method of manufacturing the same
A technology of semiconductors and components, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problem of filling conductive substances in through holes, and achieve the effect of low process defects
Active Publication Date: 2017-05-03
NEPES CO LTD
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Problems solved by technology
However, there are limitations that it is difficult to precisely form the via holes formed on the package mold and to densely fill the conductive substances in the via holes.
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[0017] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention are provided in order to more completely describe the technical idea of the present invention to those skilled in the art. The following embodiments can be changed into various other ways, and the scope of the technical idea of the present invention is not limited to the following Rather, these embodiments make the disclosure of the present invention more substantial and complete, and are provided to fully convey the technical idea of the present invention to those skilled in the art. The term "and / or" as used in this specification includes any one and all combinations of more than one of the corresponding listed items. The same symbols always mean the same elements. In addition, various elements and areas in the drawings are schematically drawn. Therefore, the technical idea of the presen...
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The present invention provides a method of manufacturing a semiconductor assembly including precise and low-process through-wiring. The method of manufacturing a semiconductor assembly in one embodiment of the present invention includes the following steps: a step of preparing a conductive member; removing a part of the conductive member and A step of forming a flat portion and a protrusion protruding from the flat portion; a step of forming a sealing member that seals a conductive member; a step of removing a part of the sealing member so that the protrusion of the conductive member is exposed from the sealing member to form a through wiring; A step of forming a rewiring pattern layer electrically connected to the through wiring on the through wiring; a step of mounting a semiconductor chip on the rewiring pattern layer; and a step of forming an external connection member electrically connected to the through wiring.
Description
technical field [0001] The technical idea of the present invention relates to a semiconductor component, and more specifically, to a semiconductor component including through wiring and a manufacturing method thereof. Background technique [0002] In recent years, with the miniaturization of process technology and the diversification of functions of semiconductor components, the chip size has decreased, and with the increase in the number of output and input terminals, the electrode pad spacing has gradually become smaller. With the integration of various functions Acceleration, the system-in-package technology that integrates various components into one package is gradually emerging. In addition, in the system-in-package technology, in order to minimize the noise between operations and increase the signal speed, it is gradually changing to a three-dimensional stacking technology method that can maintain a short signal distance. On the other hand, in order to meet the dem...
Claims
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IPC IPC(8): H01L23/48H01L21/60
CPCH01L21/486H01L21/563H01L21/6835H01L23/49816H01L23/49827H01L24/13H01L24/16H01L24/81H01L2221/68359H01L2221/68368H01L2221/68377H01L2224/131H01L2224/16225H01L2224/16227H01L2224/73204H01L2224/81191H01L2224/81424H01L2224/81447H01L2224/81815H01L2224/831H01L2924/00014H01L2924/014H01L23/12H01L23/48
Inventor 苏赛贤萧元甄王传伟苏孝文陈浩洋
Owner NEPES CO LTD