Ion palladium activation solution and preparation method thereof, and non-metallic chemical plating method
A palladium activation and ion technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems of short service life, poor activation effect, and inability to achieve selective activation, and achieve great application value, good activation effect
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[0016] The invention also provides a preparation method of the ionic palladium activation solution, which only needs to disperse each component uniformly in water. Specifically, the halogen compound can be dissolved in water first, then add soluble palladium salt until dissolved, and finally add dimercaptobenzothiazole until dissolved. Preferably, after adding dimercaptobenzothiazole to dissolve, it also includes the step of incubating the ionic palladium activation solution at 50-60°C for 2-6 hours.
[0017] The present invention also provides a method for non-metallic electroless plating, comprising firstly using an ionic palladium activation solution to activate the roughened non-metallic piece to be plated, then placing it in an ionic palladium reducing solution for reduction treatment, and finally immersing it in Electroless plating is carried out in the electroless plating solution; wherein, the ionic palladium activation solution is the ionic palladium activation soluti...
Embodiment 1
[0026] (1) Prepare ionic palladium living solution S1: Dissolve hydrochloric acid in water, then add palladium chloride, stir until dissolved, then add dimercaptobenzothiazole, stir until completely dissolved, and keep warm at 50°C for 4 hours; Its composition is: palladium chloride 0.02g / L, hydrochloric acid 15g / L, dimercaptobenzothiazole 0.0015g / L;
[0027] (2) The 2cm×2cm ABS plastic parts to be plated are first degreased by ultrasonic, then roughened with chromic anhydride, and then immersed in the ionic palladium activation solution S1 prepared in step (1) for activation treatment, the temperature is 25°C, and the time is 3 Minutes later; then take it out and wash it with water for 2 minutes, then immerse it in the ionic palladium reducing solution (sodium borohydride 1g / L, sodium hydroxide 1g / L) at 50°C for 3 minutes, take it out and immerse it in the electroless copper plating solution for chemical Copper plating to obtain plated parts.
Embodiment 2
[0029] Using the same steps as in Example 1 (1) to prepare ionic palladium activation solution S2, and then perform electroless plating in step (2) to obtain plated parts; the difference is that in step (1), the composition of ionic palladium activation solution S2 For: palladium chloride 0.5g / L, hydrochloric acid 80g / L, dimercaptobenzothiazole 0.005g / L.
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