Ion palladium activation solution and preparation method thereof, and non-metallic chemical plating method

A palladium activation and ion technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems of short service life, poor activation effect, and inability to achieve selective activation, and achieve great application value, good activation effect

Active Publication Date: 2014-12-31
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention solves the technical problems in the prior art that the activation solution used in the activation treatment

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0016] The invention also provides a preparation method of the ionic palladium activation solution, which only needs to disperse each component uniformly in water. Specifically, the halogen compound can be dissolved in water first, then add soluble palladium salt until dissolved, and finally add dimercaptobenzothiazole until dissolved. Preferably, after adding dimercaptobenzothiazole to dissolve, it also includes the step of incubating the ionic palladium activation solution at 50-60°C for 2-6 hours.

[0017] The present invention also provides a method for non-metallic electroless plating, comprising firstly using an ionic palladium activation solution to activate the roughened non-metallic piece to be plated, then placing it in an ionic palladium reducing solution for reduction treatment, and finally immersing it in Electroless plating is carried out in the electroless plating solution; wherein, the ionic palladium activation solution is the ionic palladium activation soluti...

Embodiment 1

[0026] (1) Prepare ionic palladium living solution S1: Dissolve hydrochloric acid in water, then add palladium chloride, stir until dissolved, then add dimercaptobenzothiazole, stir until completely dissolved, and keep warm at 50°C for 4 hours; Its composition is: palladium chloride 0.02g / L, hydrochloric acid 15g / L, dimercaptobenzothiazole 0.0015g / L;

[0027] (2) The 2cm×2cm ABS plastic parts to be plated are first degreased by ultrasonic, then roughened with chromic anhydride, and then immersed in the ionic palladium activation solution S1 prepared in step (1) for activation treatment, the temperature is 25°C, and the time is 3 Minutes later; then take it out and wash it with water for 2 minutes, then immerse it in the ionic palladium reducing solution (sodium borohydride 1g / L, sodium hydroxide 1g / L) at 50°C for 3 minutes, take it out and immerse it in the electroless copper plating solution for chemical Copper plating to obtain plated parts.

Embodiment 2

[0029] Using the same steps as in Example 1 (1) to prepare ionic palladium activation solution S2, and then perform electroless plating in step (2) to obtain plated parts; the difference is that in step (1), the composition of ionic palladium activation solution S2 For: palladium chloride 0.5g / L, hydrochloric acid 80g / L, dimercaptobenzothiazole 0.005g / L.

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PUM

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Abstract

The invention provides an ion palladium activation solution, wherein the ion palladium activation solution is an aqueous solution containing a soluble palladium salt and a complexing agent, and the complexing agent contains a halogen compound and dimercaptobenzothiazole. The invention also provides a preparation method of the ion palladium activation solution, and a method adopting the ion palladium activation solution for non-metallic chemical plating. The ion palladium activation solution provided by the invention is long in service life and relatively good in activation effect, besides, can realize selective activation, and has relatively great application value for local or line electroplating.

Description

technical field [0001] The invention belongs to the technical field of pretreatment of non-metallic surface electroless plating, and in particular relates to an ionic palladium activation and a preparation method thereof and a method of non-metallic electroless plating. Background technique [0002] Most non-metallic materials are non-conductors, and a conductive film must be prepared before the surface is electroplated. At present, the commonly used method is electroless plating first. Before electroless plating, the substrate must be pretreated, generally including degreasing, roughening, reduction, activation, reduction and other steps. Among them, the purpose of activation is to adsorb a certain amount of activation center on the non-metallic substrate, so as to induce the subsequent electroless plating. Activation not only determines the quality of the electroless coating, but also determines the quality of the coating. [0003] The activation process used in the earl...

Claims

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Application Information

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IPC IPC(8): C23C18/18C23C18/30
Inventor 韦家亮
Owner BYD CO LTD
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