A kind of ionic palladium activation solution and its preparation method and a kind of method of non-metal electroless plating
A palladium activation and ion technology, applied in liquid chemical plating, metal material coating technology, coating, etc., can solve the problems of short service life, poor activation effect, and inability to achieve selective activation, and achieve good activation effect, The effect of great application value
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[0016] The present invention also provides a method for preparing the ionic palladium activation solution, which requires that each component is uniformly dispersed in water. Specifically, the halogen compound can be dissolved in water first, then soluble palladium salt is added to dissolve, and finally dimercaptobenzothiazole is added to dissolve. Preferably, after the dimercaptobenzothiazole is added to dissolve, the step of maintaining the ionic palladium activation solution at 50-60°C for 2-6 hours is also included.
[0017] The present invention also provides a method for non-metal electroless plating, which includes firstly using an ion palladium activating solution to activate the roughened non-metallic article to be plated, then placing it in an ion palladium reducing solution for reduction treatment, and finally immersing it in Electroless plating is performed in an electroless plating solution; wherein the ionic palladium activation solution is the ionic palladium activ...
Embodiment 1
[0026] (1) Preparation of ionic palladium active solution S1: Dissolve hydrochloric acid in water, then add palladium chloride, stir to dissolve, then add dimercaptobenzothiazole, stir until completely dissolved, and keep it at 50°C for 4 hours; Its composition is: palladium chloride 0.02g / L, hydrochloric acid 15g / L, dimercaptobenzothiazole 0.0015g / L;
[0027] (2) The 2cm×2cm ABS plastic parts to be plated are first subjected to ultrasonic degreasing, then coarsened with chromic anhydride, and then immersed in the ionic palladium activation solution S1 prepared in step (1) for activation treatment, the temperature is 25℃, and the time is 3 Minutes later; then take it out and wash with water for 2 minutes, then immerse in 50℃ ionic palladium reduction solution (sodium borohydride 1g / L, sodium hydroxide 1g / L) for 3 minutes, take it out and immerse in electroless copper plating solution for chemical Copper plating to obtain plated parts.
Embodiment 2
[0029] The same step (1) as in Example 1 was used to prepare the ion palladium activation solution S2, and then the electroless plating of step (2) was used to obtain the plated parts; the difference is that in step (1), the composition of the ion palladium activation solution S2 It is: palladium chloride 0.5g / L, hydrochloric acid 80g / L, dimercaptobenzothiazole 0.005g / L.
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