A kind of ionic palladium activation solution and its preparation method and a kind of method of non-metal electroless plating

A palladium activation and ion technology, applied in liquid chemical plating, metal material coating technology, coating, etc., can solve the problems of short service life, poor activation effect, and inability to achieve selective activation, and achieve good activation effect, The effect of great application value

Active Publication Date: 2018-01-23
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention solves the technical problems in the prior art that the activation solution used in the activation treatment before electroless copper plating has a short service life, poor activation effect and inability to realize selective activation

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0016] The present invention also provides a method for preparing the ionic palladium activation solution, which requires that each component is uniformly dispersed in water. Specifically, the halogen compound can be dissolved in water first, then soluble palladium salt is added to dissolve, and finally dimercaptobenzothiazole is added to dissolve. Preferably, after the dimercaptobenzothiazole is added to dissolve, the step of maintaining the ionic palladium activation solution at 50-60°C for 2-6 hours is also included.

[0017] The present invention also provides a method for non-metal electroless plating, which includes firstly using an ion palladium activating solution to activate the roughened non-metallic article to be plated, then placing it in an ion palladium reducing solution for reduction treatment, and finally immersing it in Electroless plating is performed in an electroless plating solution; wherein the ionic palladium activation solution is the ionic palladium activ...

Embodiment 1

[0026] (1) Preparation of ionic palladium active solution S1: Dissolve hydrochloric acid in water, then add palladium chloride, stir to dissolve, then add dimercaptobenzothiazole, stir until completely dissolved, and keep it at 50°C for 4 hours; Its composition is: palladium chloride 0.02g / L, hydrochloric acid 15g / L, dimercaptobenzothiazole 0.0015g / L;

[0027] (2) The 2cm×2cm ABS plastic parts to be plated are first subjected to ultrasonic degreasing, then coarsened with chromic anhydride, and then immersed in the ionic palladium activation solution S1 prepared in step (1) for activation treatment, the temperature is 25℃, and the time is 3 Minutes later; then take it out and wash with water for 2 minutes, then immerse in 50℃ ionic palladium reduction solution (sodium borohydride 1g / L, sodium hydroxide 1g / L) for 3 minutes, take it out and immerse in electroless copper plating solution for chemical Copper plating to obtain plated parts.

Embodiment 2

[0029] The same step (1) as in Example 1 was used to prepare the ion palladium activation solution S2, and then the electroless plating of step (2) was used to obtain the plated parts; the difference is that in step (1), the composition of the ion palladium activation solution S2 It is: palladium chloride 0.5g / L, hydrochloric acid 80g / L, dimercaptobenzothiazole 0.005g / L.

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Abstract

The invention provides an ionic palladium activation solution. The ionic palladium activation solution is an aqueous solution containing a soluble palladium salt and a complexing agent, and the complexing agent contains a halogen compound and dimercaptobenzothiazole. The invention also provides a preparation method of the ionic palladium activation solution, and a method of using the ionic palladium activation solution for non-metallic electroless plating. The ionic palladium activation solution provided by the invention has long service life, better activation effect, and can also realize selective activation, and has greater application value for local or circuit electroplating.

Description

Technical field [0001] The invention belongs to the technical field of non-metal surface chemical plating pretreatment technology, and in particular relates to an ion palladium activation and a preparation method thereof and a non-metal chemical plating method. Background technique [0002] Non-metallic materials are mostly non-conductors, and a conductive film must be prepared before electroplating on the surface. The current commonly used method is electroless plating first. Before electroless plating, the substrate must be pre-treated, which generally includes degreasing, roughening, reduction, activation, and reduction steps. Among them, the purpose of activation is to adsorb a certain amount of activated centers on the non-metallic substrate to induce subsequent electroless plating. Activation not only determines the quality of the electroless coating, but also determines the quality of the coating. [0003] The activation process used in the early days was mostly a two-step...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/18C23C18/30
Inventor 韦家亮
Owner BYD CO LTD
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