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45 results about "Electroless coating" patented technology

Lead-free electroless tin plating solution

InactiveCN102994994AEnables continuous autocatalytic depositionReduce typesLiquid/solution decomposition chemical coatingSolubilityPorosity
The invention relates to a lead-free electroless tin plating solution. The lead-free electroless tin plating solution is characterized by comprising the following components: 20 to 30g / L of stannous mono-sulphate, 60 to 120g / L of thiourea, 15 to 25g / L of citric acid, 20 to 50g / L of sulfur dioxide, 3 to 5g / L of ethylene diamine tetraacetic acid, 0.01 to 0.05g / L of polyethylene glycol, 20 to 55m / L of 98% of concentrated sulfuric acid, 0.5 to 1.0g / L of gelatin, and the balance of regulator. The lead-free electroless tin plating solution has the advantages that few categories of chemical materials are used and cost is low; the tin can be continuously deposited at a high speed on copper and a copper alloy substrate, thus semi-bright chemical coatings with different thicknesses can be produced, and the flatness of the chemical coatings can be improved; and the lead-free electroless tin plating solution is remarkable in grain refinement, low in porosity, simple in formula of plating solution, easy to control, stable in plating solution, long in service life and high in stability in batch production; and polyethylene glycol is a nontoxic and nonirritating substance with high water solubility, and can be combined with other materials without producing harmful substances.
Owner:NANTONG HUIFENG ELECTRONICS TECH

Aluminum alloy surface high-corrosion-resistant wear-resistant iron-based amorphous coating and preparation method thereof

The invention discloses an aluminum alloy surface high-corrosion-resistant wear-resistant iron-based amorphous coating and a preparation method thereof. Aluminum alloy serves as a matrix, and the high-corrosion-resistant wear-resistant iron-based amorphous coating is prepared on the surface of the matrix, so that the material has good corrosion resistance and wear resistance under certain conditions, and the coating and the matrix have good bonding strength. The preparation process comprises the following steps that (1) the aluminum alloy matrix is pretreated; (2) sand blasting treatment is carried out on the surface of the pretreated aluminum alloy matrix; and (3) supersonic flame spraying is carried out on the surface of the aluminum alloy matrix obtained after sand blasting treatment toprepare the iron-based amorphous coating. Compared with existing surface treatment technologies such as electrostatic spraying, electroless plating, anodic oxidation and vapor deposition, the prepared hot-spraying iron-based amorphous coating has high corrosion resistance and wear resistance under certain conditions. The coating and the aluminum alloy matrix can form good interface bonding, the bonding strength of the coating and the matrix is enhanced, and the coating is prevented from falling off, so that the coating has excellent durability, and the surface of aluminum alloy can be effectively protected.
Owner:UNIV OF SCI & TECH BEIJING

Graphene-loaded nano copper particle composite material and preparation method thereof

The invention discloses a graphene-loaded nano copper particle composite material and a preparation method thereof. The composite material is composed of a graphene sheet layer and a chemical coatingon the surface of the graphene sheet layer, and the chemical coating is nano copper with a face-centered cubic structure. The preparation method comprises the following steps: (1) immersing graphene into water for ultrasonic dispersion, then putting the graphene into sensitization liquid, and carrying out sensitization treatment on 90-100 DEG C; (2) taking out and washing the sensitized graphene,putting the sensitized graphene in an activating solution, and stirring and activating to obtain activated graphene; (3) taking out and washing the activated graphene, and then placing the activated graphene in a plating solution containing main salt and reducing agent components; (4) heating the plating solution, adjusting the pH value, and preserving heat; and (5) washing and drying the copper plating graphene. According to the method disclosed by the invention, the stable combination between the graphene and the nano copper particles can be realized, the surface defects of the graphene arerepaired, and the comprehensive performance of the graphene is improved.
Owner:NORTHEASTERN UNIV

A silver-based circuit board with electroless nickel-palladium-gold plating and preparation method thereof

The invention discloses a silver-based circuit board with electroless nickel-palladium-gold plating and a preparation method thereof. The silver-based circuit board includes a silver-based substrate, and the surface of the silver-based substrate is sequentially plated with a nickel layer, Palladium layer, gold layer. The preparation method includes the following steps: performing micro-etching, pickling, pre-dipping, palladium activation, and post-dipping pre-treatment on the cleaned silver-based substrate in sequence, and then performing pre-treatment on the pre-treated silver-based substrate in sequence. Electroless nickel plating, electroless palladium plating, and electroless gold plating are silver-based circuit boards containing nickel-palladium-gold coating. Compared with traditional copper-based electroless nickel-palladium-gold plating, the thickness of nickel-palladium-gold electroless plating can be greatly reduced, thereby saving The use content of metals, while avoiding the problem of pollution to the environment. Furthermore, with the silver base as the base, the entire product has stronger electrical and thermal conductivity, higher sensitivity, longer life, and better overall performance.
Owner:珠海联鼎化工设备有限公司

Surface treatment process of HDI plate based on chemical nickel-gold plating coating

The invention relates to the technical field of surface treatment, in particular to a surface treatment process of an HDI plate based on a chemical nickel-gold plating coating, and the surface treatment process comprises the steps of clamping, washing, drying and polishing a plate, a washing tank is arranged in a treatment box, and the surface of the HDI plate is washed by using a pickling solution, so that the surface of the HDI plate is subjected to micro-etching; the method comprises the following steps: removing rust scale, an oxidation film and other rust on the metal surface of a pre-plated printed circuit board, activating the metal surface of an HDI plate, adding chemical plating accelerators with different functions into a pickling solution, sufficiently adsorbing the accelerators on the inner walls of blind holes and through holes of the HDI plate before chemical plating, feeding the HDI plate into a chemical plating tank, and carrying out chemical plating on the inner walls of the blind holes and the through holes of the HDI plate after the HDI plate is fed into the chemical plating tank. As the concentration of the accelerator adsorbed in the blind hole is higher than that of the accelerator adsorbed on the plate surface, the growth speed of the chemical plating layer is obviously higher than that of the plate surface, so that a good metal plating layer is obtained, and the generation efficiency of the surface coating of the HDI plate can be effectively improved.
Owner:CHANGZHOU AOHONG ELECTRONICS
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