A silver-based circuit board with electroless nickel-palladium-gold plating and preparation method thereof

An electroless nickel plating and electroless gold plating technology, applied in liquid electroless plating, metal material coating process, coating and other directions, can solve the poor gold wire bonding ability of electroless nickel plating process, difficult to form a competitive advantage, and a large amount of precious metals. Use and other issues to achieve the effect of high sensitivity, long life, and reduced thickness

Active Publication Date: 2021-09-28
珠海联鼎化工设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the commonly used electroless plating substrate is copper base, but the copper base after microetching treatment is easily polluted and oxidized by the environment.
At the same time, the use of copper-based substrates generally requires a thicker nickel layer and palladium layer to prevent the oxidation of the copper-based substrate and prevent the diffusion of copper ions to the gold layer and migration to the surface of the circuit board, causing poor solderability of the product.
Furthermore, considering factors such as its performance and production cost, many people choose the electroless nickel plating process instead of the electroless gold plating process. However, the electroless nickel plating process has poor bonding ability to gold wires, and it is difficult to form a competitive advantage and be promoted.
However, the pure chemical gold plating process causes a large amount of precious metals to be used, which not only wastes costs, but also easily pollutes the environment.
[0005] Compared with copper-based, silver-based has much better electrical conductivity, thermal conductivity, and sensitivity. It is expected to produce high-quality circuit boards with good electrical conductivity, thermal conductivity, high sensitivity, corrosion resistance, and strong oxidation resistance. However, currently In the prior art, there is no process for electroless nickel-palladium-gold plating with silver base as the substrate

Method used

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  • A silver-based circuit board with electroless nickel-palladium-gold plating and preparation method thereof
  • A silver-based circuit board with electroless nickel-palladium-gold plating and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Cleaning: Put the silver-based substrate into a super water tank filled with ultra-pure water, immerse the silver-based substrate, apply slight vibration at room temperature, and treat for 10 minutes to remove dust and other impurities on the surface of the silver-based substrate. Then put the product into a mixed solution of 3% sodium dodecylsulfonate and 20g / L sodium hydroxide for ultrasonic vibration degreasing treatment; use 50g / L dodecyl ammonium chloride and 30mL / L The chloric acid mixture is ultrasonically oscillated for deoxidation treatment.

[0048] Micro-etching treatment: place the above-mentioned cleaned silver-based substrate in a mixed solution containing 30mL / L of chloric acid and 100g / L of hydrogen peroxide for micro-etching treatment. The treatment temperature is 25°C, and the time is 2min. After treatment, the surface of the silver layer is relatively flat and smooth; the micro-etching pore size is relatively uniform, and the surface roughness is smal...

Embodiment 2

[0059] Cleaning: Put the silver-based substrate into a super water tank filled with ultra-pure water, immerse the silver-based substrate, apply slight vibration at room temperature, and treat for 10 minutes to remove dust and other impurities on the surface of the silver-based substrate. Then put the product into a mixed solution of sodium dodecylsulfonate with a mass fraction of 4% and 25g / L sodium hydroxide for ultrasonic vibration degreasing treatment; use 60g / L lauryl ammonium chloride and 30mL / L The methanesulfonic acid mixture is ultrasonically oscillated for deoxidation treatment.

[0060] Microetching treatment: place the above-mentioned cleaned silver-based substrate in a mixed solution containing 30mL / L of methanesulfonic acid and 100g / L of hydrogen peroxide for microetching treatment at a temperature of 25°C for 2 minutes. After micro-etching treatment, the surface of the silver layer is relatively flat and smooth; the micro-etching pore size is relatively uniform, ...

Embodiment 3

[0071] Cleaning: Put the silver-based substrate into a super water tank filled with ultra-pure water, immerse the silver-based substrate, apply slight vibration at room temperature, and treat for 10 minutes to remove dust and other impurities on the surface of the silver-based substrate. Then put the product into a mixed solution of sodium dodecylsulfonate and 30g / L sodium hydroxide with a mass fraction of 5% to carry out ultrasonic vibration degreasing treatment; make 80g / L lauryl ammonium chloride and 30mL / L The nitric acid mixture is ultrasonically oscillated for deoxidation treatment.

[0072]Microetching treatment: place the above-mentioned cleaned silver-based substrate in a mixed solution containing 30mL / L of methanesulfonic acid and 100g / L of potassium permanganate for microetching treatment at a temperature of 25°C for 2 minutes , after micro-etching treatment, the surface of the silver layer is flat and smooth; micro-etching pore size uniformity is good, surface roug...

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Abstract

The invention discloses a silver-based circuit board with electroless nickel-palladium-gold plating and a preparation method thereof. The silver-based circuit board includes a silver-based substrate, and the surface of the silver-based substrate is sequentially plated with a nickel layer, Palladium layer, gold layer. The preparation method includes the following steps: performing micro-etching, pickling, pre-dipping, palladium activation, and post-dipping pre-treatment on the cleaned silver-based substrate in sequence, and then performing pre-treatment on the pre-treated silver-based substrate in sequence. Electroless nickel plating, electroless palladium plating, and electroless gold plating are silver-based circuit boards containing nickel-palladium-gold coating. Compared with traditional copper-based electroless nickel-palladium-gold plating, the thickness of nickel-palladium-gold electroless plating can be greatly reduced, thereby saving The use content of metals, while avoiding the problem of pollution to the environment. Furthermore, with the silver base as the base, the entire product has stronger electrical and thermal conductivity, higher sensitivity, longer life, and better overall performance.

Description

technical field [0001] The invention relates to a silver-based circuit board with electroless nickel-palladium-gold plating and a preparation method thereof, belonging to the technical field of surface treatment technology. Background technique [0002] With the rapid development of the electronics industry, the demand for circuit boards is increasing day by day. However, today's electronic products have gradually developed towards the direction of multi-function, high performance, portability, reliability and low cost. In order to meet the needs of the market and technology, it is not only required that the electronic packaging process must move towards high-density packaging such as system packaging or IC packaging. There is a need for a coating that can meet a variety of packaging processes, so the "universal" reputation of the electroless nickel-palladium-gold surface treatment process is born from this. [0003] The main processes of electroless nickel palladium platin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/36C23C18/44C23C18/18
CPCC23C18/1651C23C18/1844C23C18/36C23C18/44
Inventor 肖忠良曾超肖敏之刘青吴道新
Owner 珠海联鼎化工设备有限公司
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