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Surface treatment process of HDI plate based on chemical nickel-gold plating coating

An electroless nickel-plating gold and surface treatment technology, which is applied in the processing of insulating substrates/layers, metal processing equipment, printed circuit liquid treatment, etc., can solve the problems of low production efficiency of electroless nickel-plating gold coatings, and achieve improved production Efficiency, guaranteed stability, and convenient production management

Active Publication Date: 2022-06-07
CHANGZHOU AOHONG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies in the prior art, the present invention provides a surface treatment process for HDI boards based on electroless nickel-plating gold coatings, which solves the problem of low production efficiency of electroless nickel-plating gold coatings on the surface of HDI boards

Method used

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  • Surface treatment process of HDI plate based on chemical nickel-gold plating coating
  • Surface treatment process of HDI plate based on chemical nickel-gold plating coating
  • Surface treatment process of HDI plate based on chemical nickel-gold plating coating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] see Figure 1-7 As shown, a surface treatment process of an HDI board based on electroless nickel-gold coating includes the following steps:

[0038]The first step, plate clamping: to carry out surface treatment on the HDI board in the surface treatment equipment, firstly, the HDI board is fed into the interior of the processing box 10 through the feeding mechanism of the board, wherein the feeding mechanism can be a mechanical arm or other intelligent mechanism, one side of the HDI board is placed between the two discharge plates 207, and then the electromagnet 209 is powered off. Under the action of the elastic potential energy of the spring 212, the two discharge plates 207 are close to each other, so that the HDI board is firmly The ground is limited between the two discharge plates 207 to complete the clamping of the HDI board;

[0039] The second step, plate flushing: drive the movable frame 205 to slide down the lower part of the fixed frame 203 through the driv...

Embodiment 2

[0043] see Figure 2-3 As shown, the surface treatment equipment in the present invention includes a treatment box 10, both sides of the treatment box 10 are provided with material openings 20, and the top of the treatment box 10 is provided with a top plate 30, and the left inside of the treatment box 10 is provided with a material washing mechanism, The washing mechanism includes a washing tank 101, and the washing tank 101 is provided with a water washing tank 102 and a pickling tank 103. The water washing tank 102 and the pickling tank 103 are provided with a nozzle 104 on one side, and the washing tank 102 and the pickling tank 103 are provided with a nozzle 104. The front of the pickling tank 103 is connected with a water inlet pipe 105 and a water outlet pipe 106. One ends of the water inlet pipe 105 and the water outlet pipe 106 both penetrate the treatment box 10 and extend to the outside of the treatment box 10, and one end of the two water inlet pipes 105 are respect...

Embodiment 3

[0045] see Figure 4-6 As shown, in the present invention, the inside of the processing box 10 is provided with a material guide mechanism, and the material guide mechanism includes a horizontal frame 201, and two horizontal frames 201 are symmetrically arranged inside the processing box 10, and the two horizontal frames 201 are on opposite sides. A linear motor 202 is provided, and a fixing frame 203 is provided on the opposite side of the two linear motors 202, and a servo electric cylinder 204 is arranged on both sides of the top of the fixing frame 203, and the two servo electric cylinders 204 drive shafts One end of each frame penetrates through the fixing frame 203 and extends to the bottom of the fixing frame 203 , a movable frame 205 is slidably arranged below the fixing frame 203 , and the two sides of the top of the movable frame 205 extend to the fixing frame respectively with the drive shafts of the two servo electric cylinders 204 The bottom end of the 203 is fixe...

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Abstract

The invention relates to the technical field of surface treatment, in particular to a surface treatment process of an HDI plate based on a chemical nickel-gold plating coating, and the surface treatment process comprises the steps of clamping, washing, drying and polishing a plate, a washing tank is arranged in a treatment box, and the surface of the HDI plate is washed by using a pickling solution, so that the surface of the HDI plate is subjected to micro-etching; the method comprises the following steps: removing rust scale, an oxidation film and other rust on the metal surface of a pre-plated printed circuit board, activating the metal surface of an HDI plate, adding chemical plating accelerators with different functions into a pickling solution, sufficiently adsorbing the accelerators on the inner walls of blind holes and through holes of the HDI plate before chemical plating, feeding the HDI plate into a chemical plating tank, and carrying out chemical plating on the inner walls of the blind holes and the through holes of the HDI plate after the HDI plate is fed into the chemical plating tank. As the concentration of the accelerator adsorbed in the blind hole is higher than that of the accelerator adsorbed on the plate surface, the growth speed of the chemical plating layer is obviously higher than that of the plate surface, so that a good metal plating layer is obtained, and the generation efficiency of the surface coating of the HDI plate can be effectively improved.

Description

technical field [0001] The invention relates to the technical field of surface treatment, in particular to a surface treatment process of an HDI board based on an electroless nickel-gold coating. Background technique [0002] HDI refers to a high-density interconnected printed circuit board. The printed circuit board is a structural element formed by insulating materials supplemented by conductor wiring. When the printed circuit board is made into the final product, integrated circuits and transistors will be installed on it. (transistors, diodes), passive components (such as resistors, capacitors, connectors, etc.) and various other electronic parts, and connected by wires, can form electronic signal connections and due functions, therefore, printed circuit boards It is a platform that provides component connection and is used to undertake the base of the connected parts; [0003] In the prior art, when chemical plating is performed on the surface of the HDI board, the sur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00B24B7/10B24B41/00B24B41/04
CPCH05K3/0085H05K3/002H05K3/0044H05K3/0055B24B7/10B24B41/005B24B41/04Y02P70/10
Inventor 陈定红沈金华
Owner CHANGZHOU AOHONG ELECTRONICS
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