Adhesion enhanced semiconductor die for mold compound packaging

a technology of mold compound and adhesive bonding die, which is applied in the direction of semiconductor devices, semiconductor/solid-state device details, electrical equipment, etc., can solve the problems of difficult to obtain a good, solid adhesive bond between the die and the package, the oxide on the silicon die substrate does not lend itself to uniform wetting, and the surface of other problems, to achieve the effect of reducing the delamination potential of the die, reducing the cracking of the package, and improving the adhesion of the di
US20050001295A1Inactive Publication Date: 2005-01-06KING JERROLD L +2
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
KING JERROLD L
Publication Date
2005-01-06
Estimated Expiration
Not applicable · inactive patent

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Abstract

A semiconductor die includes a metal layer deposited thereon for enhancing adhesion between the die and a mold compound package. The metal layer is substantially oxide free. The die is coated with a layer or layers of copper (Cu) and / or palladium (Pd) by electroplating or electroless coating techniques. The metal layer provides a uniform wetting surface for better adhesion of the die with the mold compound package during encapsulation. The increased adhesion reduces the delamination potential of the die from the package.
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Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application is a continuation application Ser. No. 10 / 309,643, filed Dec. 3, 2002, pending, which is a continuation of application Ser. No. 09 / 873,581, filed Jun. 4, 2001, now U.S. Pat. No. 6,489,186, issued Dec. 3, 2002, which is a continuation of application Ser. No. 09 / 394,180, filed Sep. 10, 1999, now U.S. Pat. No. 6,316,292, issued Nov. 13, 2001, which is a continuation of application Ser. No. 08 / 963,395, filed Nov. 3, 1997, now U.S. Pat. No. 6,066,514, issued May 23, 2000, which is a divisional of application Ser. No. 08 / 731,793, filed Oct. 18, 1996, now U.S. Pat. No. 5,760,468, issued Jun. 2, 1998, which is a continuation of application Ser. No. 08 / 306,024, filed Sep. 14, 1994, now U.S. Pat. No. 5,583,372, issued Dec. 10, 1996.BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] This invention relates in general to a semiconductor die packaging technique and, more particularly, to a die having a metal layer ba...

Claims

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