Adhesion enhanced semiconductor die for mold compound packaging

Abstract

A semiconductor die includes a metal layer deposited thereon for enhancing adhesion between the die and a mold compound package. The metal layer is substantially oxide free. The die is coated with a layer or layers of copper (Cu) and/or palladium (Pd) by electroplating or electroless coating techniques. The metal layer provides a uniform wetting surface for better adhesion of the die with the mold compound package during encapsulation. The increased adhesion reduces the delamination potential of the die from the package.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a continuation application Ser. No. 10 / 309,643, filed Dec. 3, 2002, pending, which is a continuation of application Ser. No. 09 / 873,581, filed Jun. 4, 2001, now U.S. Pat. No. 6,489,186, issued Dec. 3, 2002, which is a continuation of application Ser. No. 09 / 394,180, filed Sep. 10, 1999, now U.S. Pat. No. 6,316,292, issued Nov. 13, 2001, which is a continuation of application Ser. No. 08 / 963,395, filed Nov. 3, 1997, now U.S. Pat. No. 6,066,514, issued May 23, 2000, which is a divisional of application Ser. No. 08 / 731,793, filed Oct. 18, 1996, now U.S. Pat. No. 5,760,468, issued Jun. 2, 1998, which is a continuation of application Ser. No. 08 / 306,024, filed Sep. 14, 1994, now U.S. Pat. No. 5,583,372, issued Dec. 10, 1996.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] This invention relates in general to a semiconductor die packaging technique and, more particularly, to a die having a metal layer ba...

AI Technical Summary

Benefits of technology

[0016] Advantageously, the metal layer on the die provides a uniform wetting surface for better adhesion of the die with the mold compound during e

Problems solved by technology

Although IC packaging is minimized in each of these packaging techniques that uses an adhesive tape, other problems surface.

One such problem in the LOC technique is the difficulty of obtaining a good, solid adhesive bond between the die and the package.

One reason a solid bond is not achieved is because the oxide on the silicon die substrate does not lend itself to uniform wetting, which is necessary for good adhesion with the liquid mold compound.

When a die does not bond well with the mold compound package, delamination may occur and the device may potentially be ruined during the manufacturing process or surface mount of the package.

When the moisture is converted to steam from heat processes and the steam pressure is greater than the strength of the adhesion couple between the mold compound and the die, the mold compound will crack or explode with a “popcorn” effect.

Although th

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