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Image processing system, image processing method, and image processing program

An image processing and program technology, applied in image data processing, image data processing, image enhancement, etc., can solve problems such as the inability to maintain line width measurement accuracy

Inactive Publication Date: 2014-12-31
OLYMPUS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the measurement accuracy of the line width may not be maintained

Method used

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  • Image processing system, image processing method, and image processing program
  • Image processing system, image processing method, and image processing program
  • Image processing system, image processing method, and image processing program

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Experimental program
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Embodiment approach 1

[0032] First, the image processing system according to Embodiment 1 will be described in detail with reference to the drawings. In addition, in the following description, the flat panel display (FPD) inspection apparatus which inspects the board|substrate which is an inspection object is taken as an example and demonstrated. The FPD inspection device may be an in-line type that is directly connected to manufacturing devices such as an exposure device, a coater / developer (developer), and an etching device to inspect all substrates to be inspected, or it may be a substrate such as a cassette. Off-line type (stand-alone type) in which the stocker is directly loaded and unloaded and only a part of the boards are sampled and inspected.

[0033] In addition, the FPD inspection device targeted in the first embodiment refers to a device for measuring dimensions of metals, resists, contact holes, process misalignment, and the like in manufacturing processes in the field of semiconducto...

Embodiment approach 2

[0074] Figure 8 It is a block diagram schematically showing the configuration of the imaging device 2 as the control device according to the second embodiment. In Embodiment 2, it has been described that the image processing system is the imaging device 2 as an image processing camera including at least an imaging element such as a CMOS image sensor or a CCD image sensor.

[0075] Such as Figure 8 As shown, the imaging device 2 includes a control unit 61 , an image acquisition unit 62 , a post-processing unit 63 , a storage unit 64 , an input unit 65 , and a display unit 66 . In addition, the imaging device 2 detachably holds a frame grabber 20 a (preprocessing device) that performs predetermined processing on image data, and is connected in a communicative manner while being held. The frame grabber 20a includes a control section 21a, a transmission and reception section 22a, a preprocessing section 23a, and a first image holding section 24a. An image processing system is...

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Abstract

Provided are an image processing system, image processing method, and image processing program by which any increase in processing time can be suppressed while still maintaining measurement precision. The present invention is provided with: an image acquisition unit (31) for acquiring image data to be captured; a frame grabber (20) having a pre-processing unit (23) for subjecting the image data acquired by the image acquisition unit (31) to a predetermined pre-process; and a control device (10) which has a post-processing unit (12) for extracting image data to be measured from the image data processed by the frame grabber (20) and using the extracted image data to carry out a measurement process corresponding to a measurement item, and which retains the frame grabber (20) so as to enable communication and outputs a measurement result obtained when the post-processing unit (12) runs the measurement process.

Description

technical field [0001] The present invention relates to an image processing system, an image processing method and an image processing program for performing image processing on images. Background technique [0002] An inspection apparatus for inspecting substrates to be processed, such as glass substrates, semiconductor substrates, and printed circuit boards, has a stage on which the substrate is placed, an optical microscope, and an imaging unit to measure the line width of a micron-order pattern formed on the substrate to be processed. This inspection apparatus has an auto-focus function, and automatically focuses on a measurement point of a substrate to be processed placed on a stage to take an image. The captured image is sent to the image processing unit, and the line width of the pattern at the measurement point is measured to inspect the substrate to be processed. [0003] In addition, in the inspection apparatus described above, vibrations are generated when the op...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/02G01N21/956G06T1/00
CPCG01N21/956G01N2021/95638G06T7/0004G06T2207/10101G06T2207/30121
Inventor 坂本阳平
Owner OLYMPUS CORP