Thermal Management of Integrated Circuits Using Phase Change Materials and Heat Sinks

Abstract

At least one feature relates to a device with passive thermal management, the device comprising: an integrated circuit die, a heat sink thermally coupled to the integrated circuit die, a phase change material PCM thermally coupled to the heat sink, and A molding compound enclosing the heat sink and the PCM. In one example, the heat sink may include a plurality of fins, and at least a portion of the PCM is interposed between the plurality of fins. Another feature relates to an apparatus including an integrated circuit die and a molding compound having a phase change material mixed therein. The resulting molding compound completely encloses the die.

Description

technical field [0001] Various features relate to passive thermal management systems, methods, and apparatus for cooling integrated circuits. Background technique [0002] Advances in the electrical performance of silicon integrated circuits (ICs) have resulted in continued shrinking of integrated circuit dies. However, as the area of ​​an IC die becomes smaller, power consumption and thus power density on the die increases. Increased power density on the die translates directly to an increase in the heat generated by the die. As the temperature of the semiconductor junction increases, carrier mobility decreases, which degrades the performance of CMOS transistors and other electrical components of the IC. For example, a sustained 10°C to 15°C increase in junction temperature can result in a 50% reduction in the IC's lifetime. [0003] Also, die temperature increases may be problematic from a consumer perspective for certain types of electronic devices. For example, hand-...

AI Technical Summary

Problems solved by technology

However, these dynamic thermal management techniques can limit the operating frequency of the die 202 in order to keep the die 202 cool, thus sacrificing the performance of the package 200

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