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sn‑ag‑cu lead-free solder and method for its preparation

A lead-free solder and solder technology, used in welding equipment, welding/cutting media/materials, welding media, etc., can solve the problem of high alloy cost, improve mechanical properties, improve shape and distribution, and improve structure and mechanical properties. Effect

Active Publication Date: 2017-05-24
济南无线电十厂有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these alloys basically contain precious metal elements such as Au, Ag, etc., resulting in higher cost of the alloy, especially in recent years, the price of precious metals has risen rapidly, and the rise in the price of precious metals has limited the use of precious metals in solder alloys. , so it is of great significance to develop new solder alloys that do not contain precious metals

Method used

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  • sn‑ag‑cu lead-free solder and method for its preparation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Sn-Ag-Cu lead-free solder, the composition and content of the solder are by weight percentage, Ag: 1.0%, Cu: 0.1%, Y: 0.1%, Ce: 0.2%, and the balance is Sn.

[0020] The preparation method of above-mentioned Sn-Ag-Cu lead-free solder is realized through the following steps:

[0021] (1) Master alloy Cu-Y, Cu-Ce

[0022] At 15°C, adjust the vacuum degree of the vacuum furnace to 1 MPa, mix Cu and Y with a mass ratio of 6.5:2.5, and melt in a vacuum furnace for 5 minutes to obtain a Cu-Y master alloy; mix Cu and Y with a mass ratio of 6.0:4.0 Cu and Ce are mixed and smelted in a vacuum furnace for 5-8 minutes to obtain a Cu-Ce master alloy; the prepared Cu-Y master alloy and Cu-Ce master alloy are melted and mixed according to the mass ratio of 5.5:3.5;

[0023] (2) Preparation of Sn-Ag-Cu-Y-Ce

[0024] Put the Sn and Ag according to the above mass fractions into the molten Cu-Y and Cu-Ce master alloys, and fully stir after they are completely melted.

Embodiment 2

[0026] Sn-Ag-Cu lead-free solder, the composition and content of the solder are by weight percentage, Ag: 5.0%, Cu: 1.0%, Y: 0.5%, Ce: 0.1%, and the balance is Sn.

[0027] The preparation method of above-mentioned Sn-Ag-Cu lead-free solder is realized through the following steps:

[0028] (1) Preparation of master alloy Cu-Y, Cu-Ce

[0029] At 30°C, adjust the vacuum degree of the vacuum furnace to 5MPa, mix Cu and Y with a mass ratio of 7.5:3.5, and melt in a vacuum furnace for 8 minutes to obtain a Cu-Y master alloy; mix Cu and Y with a mass ratio of 6.5:3.5 Cu and Ce are mixed and smelted in a vacuum furnace for 5-8 minutes to obtain a Cu-Ce master alloy; the prepared Cu-Y master alloy and Cu-Ce master alloy are melted according to the mass ratio of 6:4 and then mixed;

[0030] (2) Preparation of Sn-Ag-Cu-Y-Ce

[0031] Put the Sn and Ag according to the above mass fractions into the molten Cu-Y master alloy, and fully stir after they are completely melted.

Embodiment 3

[0033] Sn-Ag-Cu lead-free solder, the composition and content of the solder are by weight percentage, Ag: 2.8%, Cu: 0.5%, Y: 0.3%, Ce: 0.5%, and the balance is Sn.

[0034] The preparation method of above-mentioned Sn-Ag-Cu lead-free solder is realized through the following steps:

[0035] (1) Preparation of master alloy Cu-Y, Cu-Ce

[0036] At 23°C, adjust the vacuum degree of the vacuum furnace to 3MPa, mix Cu and Y with a mass ratio of 7:3, and melt in a vacuum furnace for 5min to obtain a Cu-Y master alloy; mix Cu and Y with a mass ratio of 6:3 Cu and Ce are mixed and smelted in a vacuum furnace for 5-8 minutes to obtain a Cu-Ce master alloy; the prepared Cu-Y master alloy and Cu-Ce master alloy are melted and mixed according to the mass ratio of 6.5:4.5;

[0037] (2) Preparation of Sn-Ag-Cu-Y-Ce

[0038] Put the Sn and Ag according to the above mass fractions into the molten Cu-Y master alloy, and fully stir after they are completely melted.

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Abstract

The invention discloses a stannum, argentum and copper lead-free solder and a production method thereof. The stannum, argentum and copper lead-free solder is formed by, by weight, 1.0 to 5.0 % of argentum, 0.1 to 1.0 % of copper, 0.1 to 0.5% of yttrium, 0.1 to 0.5% of cerium and the balance stannum. The production method comprises adjusting the vacuum degree of a vacuum furnace into 1 to 5 MPa at the room temperature; mixing the copper with the yttrium and smelting in the vacuum furnace for 5 to 8 minutes to obtain the copper and yttrium intermediate alloy; mixing the copper with the cerium and smelting in the vacuum furnace for 5 to 8 minutes to obtain the copper and cerium intermediate alloy; placing the mass fraction of stannum and argentum into the molten copper and microelement intermediate alloy, performing full stirring after the smelting and performing cooling. According to the stannum, argentum and copper lead-free solder and the production method thereof, the trace rare earth elements yttrium and cerium are added into the stannum and copper alloy to produce the solder alloy which is good in welding performance and mechanical property and accordingly the lead-free purpose can be achieved; meanwhile precious metal elements such as gold is not contained and accordingly the cost is significantly reduced; meanwhile the organization and mechanical property of the solder alloy is improved through the trace rare earth elements and accordingly the high reliability of a solder point can be ensured and the new requirements for the solder alloy due to the rapid development of electronic products can be met.

Description

technical field [0001] The invention relates to a lead-free solder and a preparation method thereof, in particular to a Sn-Ag-Cu lead-free solder and a preparation method thereof. Background technique [0002] The "light, thin, short, and small" of electronic products puts forward higher requirements for the miniaturization and assembly density of components, and for all components, the reliability of solder joints is a key factor affecting their life , since the solder joint is the part where the stress of the whole device is concentrated, the optimal design of the solder joint and how to ensure the quality of the solder joint are important issues. As a direct result of soldering, the quality and reliability of solder joints determine the quality of electronic products. That is to say, in the production process, the quality of assembly is finally reflected in the quality of welding. Since the 1990s, the international demand for lead-free electronic products has become hig...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26
CPCB23K35/262
Inventor 史凤敏孔志刚许良军陈甘
Owner 济南无线电十厂有限责任公司