Airborne electronic module cooling device with cold accumulation function and operating method

Abstract

The invention discloses an airborne electronic module cooling device with the cold accumulation function and an operating method. The airborne electronic module cooling device comprises an electronic module, a cold accumulation part, a refrigeration part, a cooling part and a control part. The cold accumulation part comprises a heat conduction tube, a heat insulation container and a cold accumulation material. The refrigeration part comprises a semiconductor chilling plate. The cooling part comprises cooling fins and a fan. The control part comprises a temperature sensor, an integrated circuit board and an upper computer. The airborne electronic module cooling device is uniformly controlled by a single-chip microcomputer on the integrated circuit board, and control can be automatically carried out on operation of the device according to the preset temperature and input power. The device is small in size, low in power consumption, light in mass, high in integration level, flexible to arrange, high in expansibility, especially suitable for cooling electronic modules with small cooling surfaces and capable of keeping the working temperature of the electronic modules under the condition of power supply insufficiency.

Description

technical field [0001] The invention relates to the technical field of electronic module cooling, in particular to an airborne electronic module cooling device with cold storage function and an operating method. Background technique [0002] With the development of electronic integration technology, the volume of electronic modules is getting smaller and smaller, and the power is getting bigger and bigger. Traditional air cooling is difficult to meet the heat dissipation surface with higher and higher surface heat flux density. layout. The appearance of the heat pipe can conduct heat efficiently from the small heat dissipation surface, and increase the heat dissipation area at the heat dissipation end, and reproduce the selected cooling method at the heat dissipation end. As a kind of airborne electronic equipment, the cooling device must be limited by the power supply. Simple compression steam cycle refrigeration and semiconductor refrigeration have a sharp drop in eff...

AI Technical Summary

Problems solved by technology

As a kind of airborne electronic equipment, the cooling device must be limited by the power supply. Simple compression steam cycle refrigeration and semiconductor refrigeration have a sharp drop in efficiency in high temperature environments, and cannot provide sufficient refrigeration under limited power. The temperature of the electronic equipment will rise rapidly, which will affect the reliability of the work and even damage it.

Images