Electrowetting support plate with multilayer wall structure, preparation method thereof, and electrowetting device

Abstract

The invention provides a method for preparing a support plate of an electrowetting device with a multilayer wall structure, comprising the following steps: arranging pixel wall materials layer by layer on the support plate to form a pixel wall, The width is smaller than the width of the pixel wall material of the previous layer; a hydrophobic layer is covered on the surface of the formed pixel wall and the groove area surrounded by the pixel wall on the support plate; At least one protective layer, and make the protective layer at least completely cover the hydrophobic layer at the bottom of the groove area surrounded by the pixel wall; remove the hydrophobic layer on the upper surface of the pixel wall; remove the protective layer. The present invention also provides a support plate prepared by the above method and an electrowetting device comprising the support plate. The invention solves the problem of the short circuit of the upper and lower support plates caused by the gap between the hydrophobic material layer and the wall material layer, and also solves the problem of uneven thickness of the hydrophobic layer. The present invention can be used in electrowetting devices.

Description

technical field [0001] The invention relates to electrowetting technology, in particular to a support plate of an electrowetting device with a multilayer wall structure and a preparation method thereof, and an electrowetting device including the support plate. Background technique [0002] Electrowetting is also known as electrowetting. At present, electrowetting display technology has been widely used. It provides a display unit based on electrowetting technology, including a fluid chamber and an electrode structure. The fluid chamber contains conductive fluid and A non-conductive fluid, the fluids are in contact with each other and are immiscible, wherein the electrode structure comprises a first electrode in contact with the conductive fluid and a second electrode arrangement disposed at the chamber wall. International patent application WO 2003 / 071346 describes an electrowetting display device comprising two support plates, on one of which is provided a wall pattern, the...

AI Technical Summary

Problems solved by technology

However, there is a problem with this method, that is, after the hydrophobic layer material is etched into a pattern of a pixel grid shape, there are gaps due to the bonding between the hydrophobic layer and the wall material, which will cause water above the hydrophobic layer to (Or ionic liquids and salt solutions such as potassium chloride or sodium chloride aqueous solutions) short circuit after contacting the bottom electrode, thus affecting the reliability of the device

In addition, there will be problems such as the accumulation of hydrophobic layer materials at the junction of the pixel wall and the hydrophobic layer, that is, the problem of uneven thickness of the hydrophobic layer, which will affect the switching performance of the device.

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