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Abrasive grains, slurry, polishing solution, and manufacturing methods therefor

A manufacturing method and technology of grinding liquid, applied in the field of manufacturing, can solve the problems of reduced mechanical effect, reduced grinding speed, etc., and achieve the effects of improving stability, inhibiting grinding damage, improving dispersion stability and

Inactive Publication Date: 2015-01-28
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, if the average particle size becomes smaller, the grinding speed will decrease because of the decrease in mechanical effect.

Method used

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  • Abrasive grains, slurry, polishing solution, and manufacturing methods therefor
  • Abrasive grains, slurry, polishing solution, and manufacturing methods therefor
  • Abrasive grains, slurry, polishing solution, and manufacturing methods therefor

Examples

Experimental program
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Effect test

Embodiment 1～14

[0254] Add A [L] of water in the container, add concentration 50 mass % cerium ammonium nitrate aqueous solution (general formula Ce(NH 4 ) 2 (NO 3 ) 6 , formula weight 548.2g / mol, manufactured by Nippon Chemical Industry Co., Ltd., product name 50% CAN solution) B [L] for mixing. Then, the liquid temperature was adjusted to C [°C] to obtain an aqueous metal salt solution. The metal salt concentration of the metal salt aqueous solution is shown in Table 1.

[0255] Next, after preparing an aqueous solution having a concentration D [mol / L] of E [L] in which an alkaline substance shown in Table 1 was dissolved in water, the liquid temperature was adjusted to a temperature C [° C.] to obtain an alkaline solution.

[0256] Place the container containing the above metal salt solution in a sink filled with water. The temperature of the water in the water tank was adjusted to temperature C [° C.] with an external circulation device, Nix Cold Cycle (manufactured by EYELA, product...

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Abstract

A method for manufacturing abrasive grains, said method being provided with a step wherein an alkaline solution is mixed with a metal-salt solution containing a salt of a tetravalent metal, yielding particles containing a hydroxide of said tetravalent metal, wherein the temperature of the mixture of the metal-salt solution and the alkaline solution is at least 30°C.

Description

technical field [0001] The present invention relates to abrasive grains, suspensions, polishing liquids, and methods for producing them. In particular, the present invention relates to abrasive grains, suspensions, and polishing liquids used in the manufacturing process of semiconductor elements, and their manufacturing methods. Background technique [0002] In recent years, in the manufacturing process of semiconductor elements, the importance of processing technology for achieving high density and miniaturization has further increased. CMP (Chemical Mechanical Polishing) technology, one of the processing technologies, is used in the manufacturing process of semiconductor devices for the formation of shallow trench isolation (Shallow Trench Isolation, hereinafter referred to as "STI" depending on the situation), For the planarization of pre-metal insulating materials or interlayer insulating materials, the formation of plugs or embedded metal wiring, it has become an essen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/14B24B37/00C01F17/235
CPCC09G1/02C09K3/1436H01L21/31053C09K3/1463C01P2002/84C01P2004/62C01P2004/64C01P2006/22C01F17/235C09K3/1409C09K3/1454C01F17/206
Inventor 岩野友洋南久贵阿久津利明藤崎耕司
Owner RESONAC CORPORATION
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