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Nozzle unit and substrate-processing system including the nozzle unit

A nozzle unit and substrate processing technology, applied in the direction of spraying devices, electrical components, spraying devices, etc., can solve the problems of concentration and life reduction, film quality decline, etc., and achieve the effect of preventing thermal decomposition and suppressing temperature rise

Inactive Publication Date: 2015-02-04
KOOKJE ELECTRIC KOREA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the thin-film process, in the case of a thin-film gas that suppresses gas decomposition and directly reacts with the substrate surface in a high-temperature substrate region, if thermal decomposition proceeds due to heat, the concentration and lifetime of the gas supplied to the substrate will decrease, thereby degrade film quality

Method used

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  • Nozzle unit and substrate-processing system including the nozzle unit
  • Nozzle unit and substrate-processing system including the nozzle unit
  • Nozzle unit and substrate-processing system including the nozzle unit

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Embodiment Construction

[0032] The terms and drawings used in this specification are only for easily explaining the present invention, and therefore the present invention is not limited by the terms and drawings.

[0033] Among the techniques used in the present invention, detailed descriptions of well-known techniques that are not closely related to the idea of ​​the present invention will be omitted.

[0034] The embodiments described in this specification are used to clearly explain the present invention to those skilled in the technical field of the present invention, so the present invention is not limited to the embodiments described in this specification, and the scope of the present invention includes those that do not depart from the present invention. Modifications or modified examples of thought.

[0035] Next, an embodiment of the nozzle unit and the substrate processing equipment of the present invention will be described.

[0036] figure 1 It is a perspective view of the nozzle unit w...

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Abstract

The present invention provides a substrate-processing system. The substrate-processing system according to the present invention includes: a process tube accommodating a boat which accommodates a plurality of substrates; a heater assembly disposed so as to surround the process tube; and a nozzle unit supplying process gases into the process tube so as to form thin films on the surfaces of the substrates, wherein the nozzle unit has a heat reflection member that blocks and reflects heat energy provided by the heater assembly.

Description

technical field [0001] The present invention relates to a substrate processing apparatus, and more particularly, to a nozzle unit and a batch type substrate processing equipment. Background technique [0002] With the gradual realization of high integration of devices (Device), thin film evaporation with less impurities and excellent step coverage is required. As a thin film vapor deposition method, there are various methods such as chemical vapor deposition (Chemical Vapor Deposition) and atomic layer deposition (Atomic Layer Deposition), and they are widely used. [0003] However, in such a thin-film vapor deposition apparatus, since the nozzle is formed of a quartz material, it is heated by radiant heat from a heater that heats the substrate. As a result, the reactive gas supplied to the substrate through the nozzle is also heated, and the heated reactive gas After performing thermal decomposition, it is supplied to the substrate. [0004] The above-mentioned phenomenon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05B1/02H01L21/205C23C16/44
CPCH01L21/67115C23C16/45578H01L21/67017B05B1/02C23C16/44H01L21/02367B05C1/003
Inventor 朴用城李成光金东烈
Owner KOOKJE ELECTRIC KOREA