A modular power supply with good heat dissipation

Abstract

The invention relates to a well-radiating module power supply comprising a shell (1), a circuit board body (2) and a cover board (3). Two sides of the circuit board body (2) are provided with a plurality of heating elements (9). The inner bottom of the shell (1) is provided with a plurality of recesses (4) and conductive aluminum strips (5). The circuit board body (2) is disposed within the shell (1). Protrusions of the heating elements (9) are embedded in the recesses (4). The conductive aluminum strips (5) are abutted to the side of the circuit board body (2). Four inner corners of the shell (1) are provided with bosses (7) integrated to the shell (1); a positioning post (8) is fixed in each boss (7). The shell (1) is internally provided with a step face (6) along the inner upper edge. The cover plate (3) covers the step face (6). The well-radiating module power supply has the advantages that radiating is effective, rotation of the positioning posts is prevented, and a circuit board is stable and reliable.

Description

technical field [0001] The invention relates to a module power supply, in particular to a module power supply with good heat dissipation. Background technique [0002] With the rapid development of microelectronics technology, DC-DC module power supplies are widely used in communication fields such as switching equipment, access equipment, mobile communications, microwave communications, optical transmission, routers, as well as automotive electronics, aerospace and other fields. When in use, the system selects the number of matching DC-DC module power supplies according to the working voltage of the circuit, and connects multiple DC-DC module power supplies together to form a power module with high power density and high conversion efficiency. Its structure is compact . Therefore, the power consumption of electronic equipment modules is increasing, and the traditional air-cooling technology can no longer meet the heat dissipation requirements of the modules. [0003] Most...

AI Technical Summary

Problems solved by technology

Therefore, the power consumption of electronic equipment modules is increasing, and the traditional air cooling technology can no longer meet the heat dissipation requirements of the modules.

[0003] Most of the existing module power supplies use air cooling or liquid cooling to dissipate heat from the internal structure of the module power supply, but both of these methods require an additional cooling structure, resulting in an increase in the size of the module power supply, which requires a very high level of integration for the module power supply It is undoubtedly a huge blow

[0004] In addition, when the module power supply is assembled, the shell and the cover are connected by rivet posts, that is, a rivet post is riveted on the four corners of the case, and the cover is closed on the case and riveted into one body by rivets and rivet posts. In the actual production process, during the riveting process, the rivet column will rotate on the shell, causing the riveting to be weak, and even the connection between the rivet column and the shell is broken, causing the shell to be scrapped

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