EEG (Electroencephalograph) electrode cap
An electrode cap and electroencephalogram technology, applied in the fields of transmission and bioelectric signal detection, can solve the problem of inconvenient observation of the contact between electrodes and conductive glue and the contact between conductive glue and skin, inconvenience of skin pretreatment electrodes and glue injection, and inconvenience for sleep. Or long-range EEG measurement, etc., to save measurement preparation time, easy to install and adjust electrodes, and good signal consistency.
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Embodiment 1
[0042] Example 1: is a basic embodiment of the present invention. like Figure 1-10As shown, an EEG electrode cap includes a cap body 1, an electrode 3 installed on the cap body 1, and a lead wire 4; the electrode 3 includes a fixing ring 3.1, an electrode sheet 3.2 and a bonding sealant 3.4 In the middle part of the fixed ring 3.1, there is a cavity with two ends open and communicated. There is an electrode positioning platform 3.13 in the cavity, and the electrode sheet 3.2 is placed on the electrode positioning platform 3.13; one side of the electrode sheet 3.2 is sealed by bonding The agent 3.4 is fixed to the inner wall of the cavity of the fixed ring 3.1, and the other side is combined with the conductive adhesive 3.3 in the conductive adhesive chamber 3.12 of the cavity of the fixed ring 3.1; after the adhesive sealant 3.4 is cured, there is a connection with the conductive adhesive chamber 3.12 Inject conductive glue hole 3.111; there is a fixed groove 3.11 on the o...
Embodiment 2
[0043] Example 2: It is a further embodiment on the basis of embodiment 1. The lead wire 4 is welded on the electrode sheet 3.2, and the welding point or the welding surface is sealed with an adhesive sealant 3.4. The inner wall of the cavity of the fixing ring 3.1 has an adhesive sealant groove 3.16 for reinforcing and sealing, that is, the groove is filled with adhesive sealant, so that the electrode sheet 3.2 can be fixed more firmly. The height of the fixed ring 3.1 is less than 8mm; the adhesive sealant 3.4 is epoxy resin, or polysulfide rubber sealant, or polyurethane sealing adhesive, or silicon rubber type elastic sealant. The epoxy resin may be, but not limited to, one or more combinations of thermal curing epoxy resin and light curing epoxy resin.
Embodiment 3
[0044] Example 3: The difference from embodiment 2 is that the height of the fixing ring 3.1 is less than 5.5mm.
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