Operating method for obtaining multiple transformation modes of resistance transformation memorizer
A resistance conversion and operation method technology, applied in static memory, digital memory information, information storage, etc., can solve problems such as complex methods and no practical value, and achieve the effect of simple and practical methods
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[0033] In this embodiment, an oxidized 2-inch silicon wafer is used, the active electrode is silver (Ag), the inert electrode is platinum (Pt), and the dielectric layer is silicon oxide sputtered by ion beam.
[0034] The 2-inch wafers were subjected to the standard cleaning process described above to remove surface oil and metal contamination.
[0035] The cleaned silicon wafer is oxidized in a high-temperature oxidation furnace, and an insulating silicon oxide is formed on the surface as a substrate dielectric layer with a thickness of about 100 nanometers.
[0036]First, the metal platinum with a thickness of 80 nanometers is evaporated by electron beam on the substrate, and the 9920 photoresist is spin-coated on the substrate with the grown platinum at 7000 rpm, spin coating for one minute, the thickness is about 1.2 microns, and the temperature is 85 ℃. The vacuum exposure mode was selected for exposure of the board for 4.5 minutes, and the exposure time was 3.5 seconds. ...
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