Optimization method of micro-electronic encapsulation thermal expansion coefficient reliability matching

Abstract

The invention discloses an optimization method of micro-electronic encapsulation thermal expansion coefficient reliability matching which introduces artificial intelligence theory, reliability theory and robust design theory into thermal design of micro-electronic encapsulation; micro-electronic encapsulation thermal expansion coefficient reliability matching and robust optimization based on the fusion of self-adaptive Gaussian neural network, three-level robust experimental design and non-linear finite element, use the thermal fatigue strain for encapsulating main thermal failure parts as the objective function in order to optimally match the thermal expansion coefficient of micro-electronic encapsulation device material under the effect of thermal cycle load, the optimally matched thermal expansion coefficient set is obtained in the design range, thereby reducing the maximum equivalent thermal fatigue strain inside the main thermal failure parts as much as possible. The method can both reduce the thermal mechanical failure rate of micro-electronic encapsulation under the effect of thermal cycle load, and ensure that the thermal expansion coefficient of material enables the encapsulation to maintain in high reliability under the disturbance of the thermal cycle load.

Description

technical field [0001] The invention relates to the technical field of microelectronic design and packaging, in particular to a method for optimizing reliability matching of thermal expansion coefficients of microelectronic packaging. Background technique [0002] Microelectronics technology is a new technology developed along with integrated circuits, especially ultra-large-scale integrated circuits. It is the core of high-tech and information industries. The two key technologies in the field of microelectronics are microelectronics manufacturing technology and microelectronics packaging technology. Microelectronics relies on packaging to form semiconductor devices. Packaging is a necessary condition for CI support and protection, and is also an important part of its function realization. However, the connecting parts of the microelectronic package, especially the small solder balls, will generate thermomechanical stress and strain under the action of the periodic on-off of...

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Problems solved by technology

[0004] Most of the above studies are based on the analysis of the influence of the thermal expansion coefficient of the device material around the package solder joint on the thermal failure of the package, and many important results have been obtained. Due to the thermal load of the microelectronic package, the thermal-mechanical coupling relationship is very complicated. It is a Dynamic process, so far there are few related studies on the optimization and matching of the thermal expansion coefficient of packaged devices, and no effective method for matching and optimizing the thermal expansion coefficient of microelectronic packaging based on robust design of reliability has been established, which greatly restricts the microelectronic packaging. technological development

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