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Conformal shielding structure applying lead bonding, and manufacture process thereof

A shielding structure and wire bonding technology, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of unsatisfactory shielding effect, incomplete connection of profiling shielding, etc., achieve the best electrical performance and reduce the packaging cost.

Inactive Publication Date: 2015-03-11
SUZHOU ASEN SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above two process methods are faced with the fact that the profiling shield is not completely connected to the ground plane, resulting in an unsatisfactory shielding effect

Method used

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  • Conformal shielding structure applying lead bonding, and manufacture process thereof
  • Conformal shielding structure applying lead bonding, and manufacture process thereof
  • Conformal shielding structure applying lead bonding, and manufacture process thereof

Examples

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Effect test

Embodiment 1

[0032] In this embodiment, the metal layer is a Cu—Co—Si electromagnetic shielding layer with a thickness of about 2.0 μm. The electromagnetic shielding layer is obtained by magnetron sputtering coating, the sputtering target is a Cu-Co-Si composite target, and the mass percentage of Co in the composite target is 32wt%, and the mass percentage of Si is is 3wt%, and the balance is Cu; the sputtering process is: argon is used as the working gas, and its flow rate is 100-200 sccm; the sputtering power is 20kW, and the coating temperature is 50°C.

Embodiment 2

[0034] In this embodiment, the metal layer is a Cu—Co—Si electromagnetic shielding layer with a thickness of about 2.0 μm. The electromagnetic shielding layer is obtained by magnetron sputtering coating, the sputtering target is a Cu-Co-Si composite target, and the mass percentage of Co in the composite target is 35wt%, and the mass percentage of Si is is 6wt%, and the balance is Cu; the sputtering process is: argon is used as the working gas, and its flow rate is 100-200 sccm; the sputtering power is 20kW, and the coating temperature is 50°C.

Embodiment 3

[0036] In this embodiment, the metal layer is a Cu—Co—Si electromagnetic shielding layer with a thickness of about 5.0 μm. The electromagnetic shielding layer is obtained by magnetron sputtering coating, the sputtering target is a Cu-Co-Si composite target, and the mass percentage of Co in the composite target is 32wt%, and the mass percentage of Si is is 3wt%, and the balance is Cu; the sputtering process is: argon is used as the working gas, and its flow rate is 100-200 sccm; the sputtering power is 20kW, and the coating temperature is 50°C.

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Abstract

The invention relates to a manufacture process of a conformal shielding structure applying lead bonding. The process comprises the following steps: preparing a substrate with multiple radio frequency module units arranged thereon, adjacent radio frequency module units being bonded through multiple leads; connecting the bottom ends of the multiple leads to a grounding layer; performing glue sealing on the multiple radio frequency module units on the substrate by use of filling resins, the height of the filling resins being higher than the height of any leads; performing semi-cutting or total cutting between the adjacent radio frequency module units to enable the leads to be exposed from the side walls of the filling resins; and performing sputtering to deposit metal layers on the surfaces of the filling resins, the metal layers being in contact with the leads so as to enable the metal layers to be connected with the grounding layer. The manufacture process of the conformal shielding structure, provided by the invention, ingeniously applies the lead bonding, can easily enable the shielding layers in radio frequency modules to be conducted with internal circuits, and can ensure that the shielding layers of the radio frequency modules are effectively grounded without using any additional components for connection with the side wall.

Description

technical field [0001] The present invention relates to the technical field of electronic package shielding, more specifically, the present invention relates to a conformal shielding structure (conformal shielding) using wire bonding and its manufacturing process. Background technique [0002] Electromagnetic Interference (EMI) and Radio Interference (RFI) are ubiquitous in the modern information society. As the integration of integrated circuit radio frequency modules in electronic products is getting higher and higher, electronic products are becoming more and more miniaturized, but their functions are becoming more powerful, and the resulting electromagnetic wave intensity is also correspondingly increased, which will directly or indirectly Cause electronic components, electrical equipment to malfunction or system failure. In the era of rapid development of the microelectronics industry, the use of electromagnetic shielding is a necessary means of protection against elec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/552
CPCH01L2924/181H01L24/97H01L2224/16225H01L2924/19105H01L2924/19107H01L2224/97H01L2924/3025H01L2924/00012H01L2224/81
Inventor 李荣哲郭桂冠
Owner SUZHOU ASEN SEMICON CO LTD
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