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porous carbon composition

A composition, porous carbon technology, applied in the preparation/purification of carbon compounds, carbon, ceramic products, etc., can solve the problem of plastic properties not meeting foaming requirements and other problems

Inactive Publication Date: 2017-05-03
BLUE CUBE IP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main problem with these untreated precursors is that their plastic properties are often not sufficient for foaming

Method used

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Embodiment approach

[0050]

[0051] Structure VII below shows yet another embodiment of the preferred chemical structure of the DVBDO that can be used in the present invention:

[0052]

[0053] When DVBDO is prepared by methods known in the art, it is possible to obtain one of three possible isomers: ortho, meta, and para. Accordingly, the present invention includes DVBDOs illustrated by any one of the above structures individually or as a mixture thereof. Structures VI and VII above show the meta (1,3-DVBDO) and para (1,4-DVBDO) isomers of DVBDO, respectively. The ortho isomer is rare; DVBDO is generally produced in most cases in a ratio of meta (structure VI) to para (structure VII) isomers in the range of 9:1 to 1:9. As an embodiment, the present invention preferably includes a ratio of structure VI to structure VII in the range of 6:1 to 1:6, and in other embodiments, the ratio of structure VI to structure VII may be in the range of 4:1 to 1:4 or 2:1 to 1:2 range.

[0054] In yet an...

Embodiment 1

[0142] In this Example 1, a closed-cell porous carbon composition was generated using a porogen, 100-200 Dowex® commercially available from The Dow Chemical Company TM 1x 8 ion exchange resin.

[0143] About 35% by weight of the porogen was added to a curable liquid carbon precursor formulation made from a mixture of DVBDO, p-cresol and MPTS in a weight ratio of 85 / 14 / 1. The resulting preparation was processed in Flack Tek Inc. Speedmixer TM (high shear mixer) for about 1 minute.

[0144] The formulation is poured into a mold to form a disc-shaped element, and then the formulation is cured according to the following curing schedule:

[0145] temperature(℃) 60 80 100 110 120 130 140 150 160 175 200 220 time (minutes) 15 15 30 15 15 15 15 15 15 15 15 15

[0146] The disc-shaped solidified formulation had a diameter of about 7 cm and a thickness of about 1.5 mm. A 1.8 mg sample cut from the center of the above disk (i.e., a portion ...

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Abstract

A curable liquid carbon precursor formulation for preparing a porous carbon composition comprising (a) at least one aromatic epoxy resin; (b) (i) at least one aromatic co-reactive curing agent, or (b) (ii) at least one catalytic curing agent, or (b) (iii) a mixture thereof; and (c) at least one porogen; having a neat viscosity of less than 10,000 mPa-s at 25°C before selected components, before curing and before carbonization; and wherein the liquid composition subjected to curing has a carbon yield of at least 35% by weight, regardless of the the weight of porogen and any optional components present in said composition; a method of preparing said porous carbon composition from said formulation, said method comprising the steps of: curing said formulation, and carbonizing The cured product produced by the above formulation, thereby producing a porous carbon composition; and the porous carbon composition produced by the above method.

Description

technical field [0001] The present invention relates to porous carbon compositions and methods of making the porous carbon compositions. Background technique [0002] Thermal management is a critical issue in the electronics industry. More than 55 percent (%) of electronic product failures are due to temperature-related problems. A 10°C reduction in component temperature can double product life. Commonly used materials for thermal management today are metals, such as aluminum and copper, but there are still some unmet needs when utilizing said prior art materials, such as (1) better heat dissipation (faster and more efficient ), (2) lower thermal stress (CTE matching), (3) smaller weight and volume, and (4) lower cost. Recently, porous carbon compositions have been used as materials for the electronics industry, but known porous carbon compositions require complicated manufacturing processes, making known porous carbon compositions not economically viable. [0003] A num...

Claims

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Application Information

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IPC IPC(8): C01B32/05C04B35/52C04B38/00C08J5/24C04B35/524
CPCC04B35/524C04B38/0032C08J9/36C08J2363/00C04B35/6269C04B35/63452C04B2235/6562C08J9/122C08J9/127C08J9/141C08J9/143C08J9/149C08J9/32C08J2203/06C08J2203/14C08J2203/142C08J2203/182C04B2111/00793C04B2111/0081C04B2111/00836C04B2111/00844C04B2111/00853C01B32/00C01B32/05C04B35/52C04B38/02C04B38/0615C04B38/08C04B38/10F16L59/028
Inventor H·拉克劳特M·J·马克斯L·瓦勒特D·D·拉萨姆
Owner BLUE CUBE IP