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Sputtering source water treatment device and water treatment method

A technology of water treatment device and sputtering source, applied in water/sewage treatment, non-polluting water treatment, chemical instruments and methods, etc., can solve problems such as large corrosion

Inactive Publication Date: 2015-03-25
WUHU VACUUM TECH
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  • Summary
  • Abstract
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  • Claims
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Problems solved by technology

[0004] In view of the above-mentioned prior art, the object of the present invention is to overcome the problem that the water in the magnetron sputtering device in the prior art corrodes the sputtering source assembly during use, thereby providing a sputtering source assembly that is less corrosive to the sputtering source assembly. Small, Sputtering Source Water Treatment Device and Water Treatment Method for Prolonging Magnet Service Life

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  • Sputtering source water treatment device and water treatment method

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Embodiment Construction

[0023] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0024] The present invention provides a sputtering source water treatment device, wherein the device includes a water inlet pipe 1, a sputtering source assembly 2 and a water outlet pipe 3 arranged in sequence, wherein the sputtering source assembly 2 also includes at least A magnet 4 with a ceramic thin film attached to its surface.

[0025] The above design attaches a ceramic thin film to the surface of the magnet 4 in the sputtering source assembly 2, so that in actual use, when water passes through the sputtering source assembly 2, the magnet most likely to be corroded in the sputtering source assembly 2 4 is protected, so that the degree of corrosion of th...

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Abstract

The invention discloses a sputtering source water treatment device and a water treatment method. The device comprises a water inlet pipe (1), a sputtering source assembly (2) and a water outlet pipe (3) which are sequentially arranged, wherein at least one magnet (4) the surface of which is attached by a ceramic film is arranged in the sputtering source assembly (2). According to the device disclosed by the invention, the ceramic film is attached to the surface of each magnet in the sputtering source assembly, so that when water passes through the sputtering source assembly, the magnets which are easily corroded in the sputtering source assembly are protected in the actual application process, and the corroded degree of the sputtering source assembly is further greatly reduced. Therefore, the sputtering device is effectively protected, and the service life of the device is greatly prolonged.

Description

technical field [0001] The invention relates to the field of cooling water treatment in a sputtering source, in particular to a sputtering source water treatment device and a water treatment method. Background technique [0002] In the magnetron sputtering device, cooling water is required, and the cooling water will flow into the sputtering source assembly in the magnetron sputtering device, but the sputtering source assembly is often damaged due to its internal structure during use. The potential sequences of the materials are different from each other, so there are more chemical reactions such as substitution, especially the magnet in the sputtering source component, which is very easy to react with it. [0003] Therefore, it is an urgent problem to be solved in the present invention to provide a sputtering source water treatment device and a water treatment method that less corrode the sputtering source components and prolong the service life of the magnet. Contents of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C02F1/00C02F9/04C02F103/02
Inventor 薛辉任俊春金海涛
Owner WUHU VACUUM TECH
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