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No-lead soft brazing alloy

A technology of soft solder and solder, applied in welding/cutting medium/material, welding medium, metal processing equipment, etc., can solve the problems of large corrosion of copper and low degree of corrosion

Active Publication Date: 2009-03-18
ZHEJIANG ASIA GENERAL SOLDERING & BRAZING MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention will solve the problem that the lead-free solder in the known technology is excessively eroded to copper in the wave soldering process, and provides the lead-free solder of the present invention for this reason, and this solder has a low corrosion degree to copper , and has the advantages of good mechanical properties and wettability

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0039] Put 48.5Kg of Sn and 1.5Kg of Cu into an alumina crucible, put it into an intermediate frequency furnace for melting, the melting temperature is 600°C, keep it warm for 2 hours, fully stir it, take it out of the furnace, and cool it to make Sn—Cu containing 3% Cu master alloy.

[0040] Put 49.5Kg of Sn and 0.5Kg of In into an alumina crucible, put it into an intermediate frequency furnace for melting, the melting temperature is 400°C, keep it warm for 1 hour, fully stir it, take it out of the furnace, and cool it to make Sn-In containing 1% In master alloy.

[0041] Put 49.75Kg of Sn into an alumina crucible for melting at 500°C; after the tin is melted, press 0.25Kg of P into the tin liquid with a graphite bell jar with small holes around it, and keep stirring; After 6 hours, fully stir and take out of the furnace, cool to make a Sn—P master alloy containing 0.5% P.

[0042] Put 49.5Kg of Sn and 0.5Kg of Ni into an alumina crucible, put it into a vacuum intermediate ...

Embodiment 2

[0046] Take Example 1 Sn-Cu master alloy 1.167Kg, Sn-In master alloy 0.050Kg, Sn-P master alloy 1.000Kg and pure tin 2.783Kg, put it into a stainless steel pot for melting, the melting temperature is 600°C, and the holding time is 1 hour , out of the furnace after fully stirring, and cast on a steel welding rod mold to obtain lead-free solder bar.

Embodiment 3

[0048] Get embodiment 1 Sn-Cu master alloy 1.167Kg, Sn-In master alloy 0.250Kg, Sn-P master alloy 0.500Kg, Sn-Ni master alloy 0.100Kg and pure tin 2.983Kg, put into stainless steel pot and smelt, melting temperature is 600°C, the holding time is 1 hour, fully stirred and then released from the furnace, cast on a steel electrode mold to obtain lead-free solder rods.

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Abstract

The no-lead soft brazing alloy has low Cu corrosion, high wettability and excellent mechanical performance. There are four types of no-lead soft brazing alloy, the first one consists of Cu 1.0.4-0.9 wt%, In 0.005-0.095 wt%, P 0.001-0.15 wt%, and Sn for the rest; the second one consists of Cu 2.0.4-0.9 wt%, In 0.005-0.095 wt%, P 0.001-0.15 wt%, Ni 0.01- 0.2 wt%, and Sn for the rest; the third one consists of Cu 3.0.4-0.9 wt%, In 0.005-0.095 wt%, P 0.001- 0.15 wt%, RE 0.002-0.2 wt%, and Sn for the rest; and the fourth one consists of Cu 4.0.4-0.9 wt%, In 0.005-0.095 wt%, P 0.001-0.15 wt%, Ni 0.01-0.2 wt%, RE 0.002-0.2 wt%, and Sn for the rest. The present invention is suitable for no-lead assembling and packaging in electronic industry.

Description

technical field [0001] The invention relates to solder, especially lead-free solder, which is mainly used for lead-free assembly and packaging in the electronic industry. Background technique [0002] Wave soldering has significant advantages such as high production efficiency, high reliability of solder joints, and low cost. It is an important process in electronic assembly, and the performance of solder is an important prerequisite for good wave soldering of electronic components. The traditional wave soldering solder is tin-lead solder. However, in recent years, people have paid more and more attention to the pollution of lead to the environment and the damage to health. Many countries have successively issued a series of laws and regulations to prevent and control electronic products. The resulting ecological problems limit the use of lead in electronic products. Under the general trend of lead-free green manufacturing, the electronics industry has also started lead-fre...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26
Inventor 王大勇顾小龙
Owner ZHEJIANG ASIA GENERAL SOLDERING & BRAZING MATERIAL
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