A dry film sticking machine and a dry film sticking method
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NANTONG FUJITSU MICROELECTRONICS
- Publication Date
- 2017-11-07
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Abstract
Description
technical field
[0001] The invention relates to the technical field of semiconductor packaging, in particular to a dry film sticking machine and a dry film sticking method. Background technique
[0002] When pasting the dry film, first peel off the polyethylene protective film from the dry film, and then paste the dry film resist on the copper clad board under heat and pressure. The resist layer in the dry film becomes soft after being heated, and its fluidity increases, and the film is pasted by means of the pressure of the hot pressing roller and the action of the adhesive in the resist. The film sticking is usually done on a film sticking machine. There are many types of film sticking machines, but the basic structure is roughly the same. The main factors that affect the effect of film application are pressure, temperature and transmission speed, and these three factors are all affected by the film application time, so controlling the film application time is very import...