A plastic packaging material loading device

Abstract

The invention discloses a loading device of a plastic package material. The loading device of the plastic package material comprises a material loading box (1); the upper end of the material loading box (1) is opened with a charging opening (2); the lower end of the material loading box (1) is opened with a discharging opening (3); two side walls of the lower end of the material loading box (1) are respectively and fixedly connected with guide rails (4); a base plate (6) is installed between two guide rails (4); an inserting plate (8) is arranged on the base plate (6); the inserting plate (8) is inserted in the discharging opening (3); a material detector (10) is installed on the inner wall of the discharging opening (3); two side walls of the upper end of the material loading box (1) are further provided with stoppers (11), and a cylinder (12) is installed above one stopper (11); the piston rod of the cylinder (12) blocks the stoppers (11); the cylinder (12) is controlled by a processor; and the processor is connected with the material loading box (1) through the wireless signal. The beneficial effect of the loading device of the plastic package material is simple operation, high product processing quality and high product processing efficiency.

Description

technical field [0001] The invention relates to a loading device, in particular to a molding compound loading device. Background technique [0002] Epoxy molding compound (EMC-Epoxy Molding Compound) is epoxy resin molding compound and epoxy molding compound. Powder molding compound made of various additives. More than 97% of plastic packaging (referred to as plastic packaging) materials use EMC. The plastic packaging process uses transfer molding to extrude EMC into the mold cavity, embeds the semiconductor chip in it, and cross-links and solidifies it at the same time to become a product with a certain structural appearance. Semiconductor device. [0003] The molding compound loading device used in the existing molding compound processing equipment has a constant amount of molding compound and cannot be adjusted, so that the processing efficiency of the molding compound cannot be changed. Moreover, during the processing of the existing molding compound, due to the operat...

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Problems solved by technology

[0003] The molding compound loading device used in the existing molding compound processing equipment has a constant amount of molding compound and cannot be adjusted, so that the processing efficiency of the molding compound cannot be changed. Moreover, during the processing of the existing molding compound, due to the operation The personnel cannot accurately know whether the plastic sealing compound in the loading box has been blanked. Often during the operation of the equipment, the operator will drag the loading box out for inspection, but after the loading box is pulled out, the equipment is in idle operation, resulting in The processing efficiency of the molding compound is reduced, which affects the processing efficiency, and when the carrier box is moving back and forth, the molding compound is easily squeezed and deformed when it is at the discharge port, resulting in a low yield of the processed plastic compound

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