Low-temperature-factor anti-stress nickel zinc ferrite and preparation method thereof

Abstract

The invention relates to low-temperature-factor anti-stress nickel zinc ferrite with initial permeability for a power inductor being 500 and a preparation method of nickel zinc ferrite. Principal components of the nickel zinc ferrite are calculated in oxides as follows: 43.8 to 48.2 percent by mol of Fe2O3, 15.3 to 20.2 percent by mol of NiO, 28.8 to 31.2 percent by mol of ZnO, and 4.3 to 6.1 percent by mol of CuO; auxiliary components of the nickel zinc ferrite are: 0.90 to 1.3 percent by weight of nano SiO2, 0.13 to 0.25 percent by weight of nano Bi2O3, 0.05 to 0.08 percent by weight of Co3O4, 0.10 to 0.25 percent by weight of TiO2 and 0.1 to 0.45 percent by weight of talcum powder. The nickel zinc ferrite is prepared in an oxide method and sintered under certain conditions. The average size of crystal grains of a sintered product is 25 to 35 micrometers, the sintered product has an obvious crystal interface, the product has characteristics that the magnetic permeability is relatively small in variation in the temperature range of -40DEG C to 125 DEG C under the stress effect, and the requirement of the power inductor needing the resin encapsulation for the stress resistance of the ferrite material can be met.

Description

technical field [0001] The invention belongs to the technical field of soft magnetic ferrite, and in particular relates to a low temperature factor, stress-resistant nickel-zinc ferrite with an initial magnetic permeability of 500 and a preparation method thereof. Background technique [0002] The globalization of the market requires that all kinds of electronic components can work normally in all parts of the world, and the temperature difference around the world is very large, which requires that the raw materials that make up various devices have good temperature characteristics in a wide temperature range. Moreover, the heating phenomenon caused by eddy current loss when the ferrite is working will cause changes in magnetic properties. In order to ensure the stability of the device, the performance of the material is required to have better temperature stability, and the ferrite core is processed and assembled. Or in the process of use, the performance of the device will...

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Problems solved by technology

[0002] The globalization of the market requires that all kinds of electronic components can work normally in all parts of the world, and the temperature difference around the world is very large, which requires that the raw materials that make up various devices have good temperature characteristics in a wide temperature range. Moreover, the heating phenomenon caused by eddy current loss when the ferrite is working will cause changes in magnetic properties. In order to ensure the stability of the device, the performance of the material is required to have better temperature stability, and the ferrite core is processed and assembled. Or the process of use will affect the performance of the device due to the generation of stress or strain, resulting in unstable operation of the system, so it is particularly important to develop ferrite materials with excellent temperature stability and stress resistance characteristics

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