Gold-plated palladium solution for preparing chemical gold-plated palladium bonded silver alloy wire

A technology of chemical gold plating and silver alloy, applied in the field of metal bonding wire, can solve the problems of poor oxidation resistance and sulfidation resistance, integrated circuits can not be used normally, and nickel-palladium-gold bonding is not good enough, so as to improve the sulfidation resistance, The effect of improving oxidation resistance and meeting the requirements of packaging and use

Inactive Publication Date: 2015-04-29
北京达博有色金属焊料有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the particularity of COB module packaging, COB module packaging is different from IC and LED packaging. After packaging, the bonding wire is completely exposed to the air, and the ordinary bonding silver alloy wire has poor oxidation resistance and sulfuration resistance. , at the same time, the combination of the bonding silver alloy wire and the nickel-palladium-gold on the gold finger of the packaging is not good enough, causing the integrated circuit to not work normally

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] The method for electroless gold-plating palladium bonding silver alloy wire comprises the following steps:

[0011] (1) Casting and wire drawing: the casting temperature is 1100°C, the heating method is intermediate frequency heating, and the vacuum degree is 1*10 -5 Mpa, the refining time is 30 minutes, the intermittent casting method is adopted during continuous casting, the continuous casting speed is 300mm / min, the diameter of the formed silver alloy wire billet is 5mm, and the wire drawing speed is 200m / min.

[0012] (2) Electroless gold-plating palladium layer: the gold-palladium layer is plated on the surface of the bonded silver alloy wire by electroless plating. When gold-plating palladium is plated, the pH value of the electroless gold-plating palladium solution is 9.5, and the temperature of the gold-plated palladium solution is 40°C. The concentration of each component in the electroless gold-plating palladium solution is: 6g / L PdCl, 1g / L KAuCl 4 2H 2 O, 1...

Embodiment 2

[0015] The method for electroless gold-plating palladium bonding silver alloy wire comprises the following steps:

[0016] (1) Casting and wire drawing: the casting temperature is 1150°C, the heating method is intermediate frequency heating, and the vacuum degree is 1*10 -5 Mpa, the refining time is 30 minutes, the intermittent casting method is adopted during continuous casting, the continuous casting speed is 300mm / min, the diameter of the formed silver alloy wire billet is 8mm, and the wire drawing speed is 200m / min.

[0017] (2) Electroless gold-plating palladium layer: the gold-palladium layer is plated on the surface of the bonded silver alloy wire by electroless plating. When gold-plating palladium is plated, the pH value of the electroless gold-plating palladium solution is 11.5, and the temperature of the gold-plated palladium solution is 50°C. The concentration of each component in the electroless gold-plating palladium solution is: 27g / L PdCl, 3g / L KAuCl 4 2H 2 O,...

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PUM

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Abstract

The invention discloses a gold-plated palladium solution for preparing a chemical gold-plated palladium bonded silver alloy wire. The gold-plated palladium solution comprises the following components: 1-3 g / L of PdCl, 9-27 g / L of KAuCl4.2H2O, 10-20 g / L of NaH2PO2, 100-160 ml / L of NH4OH and 10-60g / L of NH4Cl. The gold-plated palladium bonded silver alloy wire prepared from the gold-plated palladium solution is excellent in performance, good in oxidation resistance and sulfuration resistance, and well combined with nickel palladium gold on a gold finger; a production method is safe, and environment-friendly and saves energy, and the production efficiency of a wire material is improved.

Description

technical field [0001] The invention relates to the field of metal bonding wires, in particular to a gold-plating palladium solution for preparing chemically gold-plated palladium-bonded silver alloy wires. Background technique [0002] Since gold is a precious metal, the price of gold is expensive, and the cost of COB module packaging is also very high, so it can be considered to replace gold wire with bonding silver alloy wire. However, due to the particularity of COB module packaging, COB module packaging is different from IC and LED packaging. After packaging, the bonding wire is completely exposed to the air, and the ordinary bonding silver alloy wire has poor oxidation resistance and sulfuration resistance. , At the same time, the combination of the bonding silver alloy wire and the nickel-palladium-gold on the gold finger for packaging is not good enough, causing the integrated circuit to not work normally. Contents of the invention [0003] The present invention a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/48
CPCC23C18/48
Inventor 周晓光向翠华闫茹
Owner 北京达博有色金属焊料有限责任公司
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