Packaging substrate and manufacturing method thereof
A technology for packaging substrates and manufacturing methods, which is applied in the fields of printed circuit manufacturing, multilayer circuit manufacturing, semiconductor/solid-state device manufacturing, etc., can solve problems such as packaging structure thickness reduction obstacles, improve production efficiency, save manufacturing process time, Effect of Thin Package Thickness
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[0040] Figure 1A to Figure 1H is a schematic cross-sectional view of manufacturing process steps of a packaging carrier according to an embodiment of the present invention. In this embodiment, the manufacturing method of the packaging carrier includes the following steps: first, please refer to Figure 1A , bonding the two base metal layers 110 . In this embodiment, the two base metal layers 110 can be two copper foil layers respectively, and the two base metal layers 110 are bonded by coating the adhesive layer 105 on the periphery of the two base metal layers 110, and the two base metal layers 110 The peripheries of the two base metal layers 110 form a bonding area to temporarily bond the two base metal layers 110 together, so as to prevent the chemicals used in the subsequent manufacturing process from penetrating between the two base metal layers 110 .
[0041] Please continue to refer to Figure 1B , press and bond the two support layers 120 on the two base metal layer...
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