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Wafer-level packaging method and packaging structure thereof

A wafer-level packaging and wafer technology, which is applied in the manufacturing of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of low input and output port density, large package volume, poor reliability, etc. The effect of small package size and thin package thickness

Active Publication Date: 2015-07-01
MEMSIC SEMICON WUXI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to overcome the defects of low input and output port density, poor reliability, low production capacity, and large packaging volume existing in existing packaging products.

Method used

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  • Wafer-level packaging method and packaging structure thereof
  • Wafer-level packaging method and packaging structure thereof
  • Wafer-level packaging method and packaging structure thereof

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Embodiment Construction

[0036] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0037] In one embodiment of the wafer level packaging method involved in the present invention, it comprises the following steps:

[0038] First, a wafer 10 comprising chip units (not shown) is provided; see figure 1 , perform the first bumping process (Bumping) and the second passivation treatment on the front side of the wafer; the first bumping process can use known methods in the industry such as electroplating, sputtering, or chemical replacement, and copper, The first bump 21 of materials such as nickel, antimony, gold or tin is grown on the front of the wafer; and the secondary passivation treatment generally involves growing a secondary passivation layer 16 on the front of the wafer, wherein the secondary passivation layer 16 can be polyimide film etc.;

[0039] Please see figure 2 , perform two grooves between adjacent bumps of ad...

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Abstract

The invention relates to a wafer-level packaging method and a packaging structure thereof. The packaging method comprises the following steps: providing a wafer which contains chip units; carrying out first protrusion fabrication process on the front face of the wafer; carrying out grooving twice between adjacent protrusions of the adjacent chip units on the front face of the wafer, wherein the width of a first groove is larger than that of a second groove, the depth of the first groove is smaller than that of the second groove and smaller than the thickness of the chip units, and the centers of the second groove and the first groove are on the same straight line which is perpendicular to the surface of the wafer; filling coating materials in the first groove and the second groove; coating the back face of the wafer, wherein the height of the coating materials is higher than the back surface of the wafer; and carrying out simplified cutting. Through a wafer protrusion technology, wafer-level partial grooving and wafer-level coating material filling, high-density input / output ports of products and high reliability are achieved, the products are light, thin and short, productivity is high, and cost is low.

Description

technical field [0001] The invention relates to semiconductor packaging technology, in particular to a wafer-level packaging method and a packaging structure thereof. Background technique [0002] With the development of semiconductor technology, the functions of semiconductor chips are becoming more and more powerful, resulting in the continuous increase of the signal transmission volume of semiconductor chips, and the requirements for high-density input and output ports of chip units are getting higher and higher. On the other hand, the development of information technology tends to be thinner and smaller, which not only requires reducing the size of the chip package, but also requires ensuring the high reliability and stability of the chip unit. [0003] Whether it is BGA (abbreviation for Ball Grid Array, Ball Grid Array) package or QFN (abbreviation for Quad Flat Non-leaded, square flat non-leaded) package, the traditional chip-level packaging has gradually failed to me...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56H01L23/31
CPCH01L2224/11H01L2924/10155
Inventor 李晓燕段志伟陈慧
Owner MEMSIC SEMICON WUXI
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