Welding device pin connecting method and device and PCB

Abstract

The invention provides a welding device pin connecting method and device and a PCB. The method includes the following steps that PCB pins of a preset number are arranged on the PCB; each PCB pin is connected with two positions of copper foil on the PCB. By changing the connecting mode of the welding device pins and the copper foil on the PCB, the problem that the welding device pins dissipate heat too fast to lead to poor tin feeding is effectively solved without increasing machining cost, the working efficiency of a PCB designer is greatly improved, and the problem that in the internal storage designing process, signals do not flow back to the ground plane is solved.

Description

technical field [0001] The invention belongs to the field of PCB design, and in particular relates to a soldering device pin connection method, a device and a PCB board. Background technique [0002] At present, in the PCB (Printed Circuit Board, printed circuit board) design, the pin connection design of the soldered device is unreasonable, which may lead to poor tinning of the soldered device during wave soldering (wave soldering, mainly used for soldering plug-ins). [0003] The conventional connection method of soldering device pins is a cross flower pad connection (that is, the soldering device pins are connected to copper foil at four places to form a cross) (such as figure 1 shown). [0004] figure 1 It is a schematic diagram of the connection of the PCB pins of the soldering device in the prior art on the negative layer copper foil. On the PCB board, there are four places for the soldering device pins (the first connection of the pin, the second connection of the p...

AI Technical Summary

Problems solved by technology

[0005] Because the soldering device pins are connected to many layers of copper foil or the total width of the copper foil connected to each layer is too large, the heat dissipation of the soldering device is too fast during wave soldering, which reduces the local temperature of the PCB and forms a shadow, resulting in poor tinning on the PCB.

[0006] In PCB design, especially when the board is relatively large and the number of layers is relatively large, in order to reduce the defect rate, it is necessary to deal with whether the soldered device pins are connected to at most three layers of large-area copper foil. It is easy to cause poor tinning during soldering

[0007] When there is a power plane on the soldering device pins, the flow must also be considered, which is not only time-consuming and laborious, but also easy to miss and handle; especially when there is a memory design, the data lines of the memory generally refer to the adjacent ground plane, digging three layers When connecting, it is possible to dig into the ground plane referenced by the data line, which is equivalent to disconnecting the copper foil of the soldered device pin and the ground plane, so that the ground plane under the data line of the memory cannot be connected to other ground planes, resulting in signal No return ground plane, causing problems with signal testing

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