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A lightweight grid structure sandwich panel integrating heat conduction and load bearing and preparation method thereof

A grid structure and sandwich panel technology, applied in chemical instruments and methods, lamination devices, lamination, etc., can solve problems such as single structural performance, poor thermal conductivity, etc., to avoid easy buckling, improve buckling resistance, and improve The effect of thermal conductivity

Inactive Publication Date: 2016-06-08
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problems of poor thermal conductivity and single structural performance of existing grid structure sandwich panels, the present invention provides a lightweight grid structure sandwich panel integrating functions of heat conduction and bearing and a preparation method thereof

Method used

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  • A lightweight grid structure sandwich panel integrating heat conduction and load bearing and preparation method thereof
  • A lightweight grid structure sandwich panel integrating heat conduction and load bearing and preparation method thereof
  • A lightweight grid structure sandwich panel integrating heat conduction and load bearing and preparation method thereof

Examples

Experimental program
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specific Embodiment approach 1

[0024] Embodiment 1: A light-weight grid structure sandwich panel integrating heat conduction and load bearing in this embodiment is composed of an upper panel 1, a grid structure sandwich layer 2 and a lower panel 3;

[0025] The grid structure sandwich layer 2 is formed by interlocking and fixing a plurality of grooved grid interlocking strips 4 of equal thickness, and the interlocking and fixing parts are connected with an adhesive;

[0026] The grooved grid interlocking strip 4 is composed of an upper laminated board 4-1, a middle carbon foam board 4-2 and a lower laminated board 4-3;

[0027] The upper surface of the middle carbon foam board 4-2 and the upper laminate 4-1 are bonded together with an adhesive, and the lower surface of the middle carbon foam board 4-2 is connected to the lower laminate 4-3. glued together with adhesive;

[0028] The upper laminate 4-1 and the lower laminate 4-3 are composite material plates or metal plates;

[0029] The upper surface of t...

specific Embodiment approach 2

[0032] Embodiment 2: This embodiment differs from Embodiment 1 in that the adhesive is an adhesive with a thermal conductivity greater than 2 W / m·K. Other steps and parameters are the same as those in the first embodiment.

specific Embodiment approach 3

[0033] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: the thickness of the interlocking fixing part is less than 0.1 mm after being cured with an adhesive. Other steps and parameters are the same as those in Embodiment 1 or 2.

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Abstract

The invention discloses a light cell structure sandwich panel integrating heat conduction and bearing and a preparation method of the light cell structure sandwich panel. The invention relates to a light cell structure sandwich panel and a preparation method thereof. According to the light cell structure sandwich panel, the problems of poor heat conduction property and single structure performance of an existing cell structure sandwich panel are solved. The light cell structure sandwich panel comprises an upper panel, a cell structure sandwich layer and a lower panel, wherein the cell structure sandwich layer is formed by mutually embedding, locking and fixing a plurality of cell embedding and locking strips which are equal in thickness and are provided with grooves, embedding, locking and fixing parts are connected by using an adhering agent; the cell embedding and locking strips with the grooves are composed of upper-layer plywood, middle-layer carbon foam plates and low-layer plywood. The preparation method comprises the following steps: firstly, preparing the upper-layer plywood and the lower-layer plywood; secondly, processing surfaces; thirdly, preparing a sandwich structure plate; fourthly, preparing the cell embedding and locking strips with the grooves; fifthly, preparing a cell structure sandwich layer; and sixthly, preparing the light cell structure sandwich panel. The light cell structure sandwich panel disclosed by the invention is of a multifunctional sandwich structure panel integrating heat conduction and bearing.

Description

technical field [0001] The invention relates to a lightweight grid structure sandwich panel and a preparation method thereof. Background technique [0002] Lightweight sandwich structures have been widely used in aerospace and other fields due to their advantages of high specific strength and specific stiffness. At present, the common lightweight sandwich structures are lattice structures and lattice structures. The honeycomb sandwich structure (hexagonal grid structure) is the most common sandwich structure in modern satellite structures. The sandwich structure is a periodic porous structure, the core has large pores, closed space (such as honeycomb, grid, etc.), the structure has poor heat dissipation capacity, poor thermal conductivity, and the thermal conductivity is lower than 2W / (m·K). The aerospace field puts forward higher design requirements for the function of the sandwich structure, not only requires lightweight, but also requires multi-functional integration, s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B3/12B32B9/04B32B7/12B32B37/12B32B37/15
CPCB32B3/12B32B5/18B32B7/12B32B9/007B32B9/04B32B37/12B32B37/15B32B2266/04
Inventor 吴林志于国财马力
Owner HARBIN INST OF TECH
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