Manufacturing method of backside image sensor

Abstract

The invention refers to the technical field of semiconductor manufacturing, and particularly relates to a manufacturing method of a backside image sensor. The manufacturing method of the backside image sensor comprises the steps: forming an interconnection hole through etching a bonded wafer, and filling a metal to form a metal lead; meanwhile, synchronously preparing a metal isolating grid and a Pad layer contacted with the metal lead at the back side of the bonded wafer, and then embedding a color filter in the metal isolating grid. According to the manufacturing method of the backside image sensor, a metal layer in the bonded wafer can be derived and integrated with the Pad, thus requirements of simple and low-cost manufacturing technique can be realized on a certain extent; meanwhile, the metal isolating grid synchronously prepared with the Pad provides a good embedding environment for the subsequent color filter, a light path is minimized, and the optical-electrical characteristic and the output quality of the backside image sensor are greatly improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for preparing a back-illuminated image sensor. Background technique [0002] With the continuous maturity and development of semiconductor manufacturing technology, image sensors are increasingly used in digital cameras, PC Cameras, video phones, third-generation mobile phones, video conferencing, intelligent security systems, car reversing sensors, toys and industrial, medical, etc. in other fields. [0003] For example, CMOS image sensors are optoelectronic components and CMOS image sensors are gradually becoming the mainstream of image sensors because their manufacturing methods are compatible with existing integrated circuit manufacturing methods, and their performance has many advantages over the original charge-coupled device (CCD). , which can integrate the driving circuit and the pixel, which simplifies the hardware design and reduces the pow...

AI Technical Summary

Problems solved by technology

[0007] In view of the above problems, the present invention provides a method for preparing a back-illuminated image sensor to solve the defects in the prior art that the preparation method of the back-illuminated image sensor is relatively complicated, the preparation cost is high, and the photoelectric characteristics and output quality are poor.

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