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Compound additive for electrolytic copper foil

A technology of compounding additives and electrolytic copper foil, which is applied in electrolytic process, electroforming, etc., and can solve the problems of lack of high-grade copper foil products

Inactive Publication Date: 2015-05-27
雷磊
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

my country's low-end copper foil production capacity is excessive, but the market has been lacking domestic high-end copper foil products

Method used

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  • Compound additive for electrolytic copper foil
  • Compound additive for electrolytic copper foil

Examples

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Embodiment example 1

[0017] Implementation case 1: A compound additive that can be used to manufacture ultra-high elongation electrolytic copper foil. Each liter of electrolytic copper foil electrolyte contains 20 mg of sodium polydisulfide dipropane sulfonate, 30 mg of triglycerin, and 5 mg of 2-mercaptobenzene And imidazole, 50mg hydrolyzed gelatin, 5mg rare earth sulfate.

Embodiment example 2

[0018] Example 2: A compound additive that can be used to manufacture ultra-high elongation electrolytic copper foil. Each liter of electrolytic copper foil electrolyte contains 20 mg sodium polydisulfide dipropane sulfonate, 50 mg triglycerin, and 5 mg 2-mercaptobenzene And imidazole, 50mg hydrolyzed gelatin, 5mg rare earth sulfate.

Embodiment example 3

[0019] Example 3: A compound additive that can be used to manufacture ultra-high elongation electrolytic copper foil, containing 20 mg sodium polydithiodipropane sulfonate, 75 mg triglycerin, and 5 mg 2-mercaptobenzene per liter of electrolytic copper foil electrolyte And imidazole, 50mg hydrolyzed gelatin, 2mg rare earth sulfate.

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Abstract

The invention relates to a compound additive for an electrolytic copper foil. The compound additive is characterized by consisting of five raw materials, namely sodium 3,3'-dithiodipropane sulfonate, polyglycerol, 2-mercaptobenzimidazole, hydrolyzed gelatin and rare earth sulfate.

Description

technical field [0001] The invention relates to a composite additive for electrolytic copper foil, which belongs to the technical field of high-end electrolytic copper foil production technology. Background technique [0002] With the development of the information society, electronic products such as ultra-thin devices, wearable devices, and smart machines emerge in an endless stream, and new electronic devices are developing towards portability and precision. Electrolytic copper foil is an important raw material for manufacturing copper clad laminates and printed circuit boards, and it is the neural network line for laying out various components of modern electronic products. [0003] Flexible Printed Circuit (FPC) has the advantages of thinness, bending resistance, and scalability, and is widely used in modern electronic products and transportation, aerospace, and military fields. Large-scale manufacturing of high-quality FPC must have high-performance electrolytic coppe...

Claims

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Application Information

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IPC IPC(8): C25D1/04C25D3/38
Inventor 雷磊
Owner 雷磊
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