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Method for chemically plating Ni-P alloy on surfaces of diamond particles

A technology of diamond particles and surface chemistry, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of complicated process, limited application, expensive drugs, etc., and achieve the effect of good effect and simple process

Inactive Publication Date: 2015-06-10
QINGDAO UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The electroless plating modification of diamond particles disclosed in the prior art requires a series of pretreatments such as oxidation, hydrophilicity, sensitization and activation on the diamond particles. The process is complicated and the drugs used are extremely expensive, which limits the practical production of this method. Applications

Method used

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  • Method for chemically plating Ni-P alloy on surfaces of diamond particles

Examples

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Effect test

Embodiment 1

[0024] A method for chemically plating Ni-P alloy on the surface of diamond particles, comprising: (1) configuring plating solution: preparing the required plating solution for chemically plating Ni-P alloy in proportion, and the formula of said plating solution is: nickel sulfate 20g / L , sodium hypophosphite 10g / L, citric acid 10g / L, sodium acetate 5g / L, potassium iodate 0.01mg / L, sodium dodecylbenzenesulfonate 0.01mg / L; (2) Heating the bath: put The plating tank with the prepared plating solution is heated in a constant temperature water bath, and the plating temperature is 80°C; (3) Add diamond particles and stir: directly add the weighed diamond particles into the above plating solution, use the The glass rod coated with Ni-P alloy was induced to activate; (4) Plating until the plating solution was tumbling: the plating time was 3 hours, and the pH value of the plating solution was adjusted with 1:5 ammonia water, and the pH value was adjusted to 4.6 until There is a tumbl...

Embodiment 2

[0026] A method for chemically plating Ni-P alloy on the surface of diamond particles, comprising: (1) configuring plating solution: preparing the required plating solution for chemically plating Ni-P alloy in proportion, and the formula of said plating solution is: nickel sulfate 28g / L , sodium hypophosphite 20g / L, citric acid 20g / L, sodium acetate 15g / L, potassium iodate 0.02mg / L, sodium dodecylbenzenesulfonate 0.02mg / L; (2) Heating the bath: put The plating tank with the prepared plating solution is heated in a constant temperature water bath, and the plating temperature is 85°C; (3) Add diamond particles and stir: directly add the weighed diamond particles into the above plating solution, use the The glass rod coated with Ni-P alloy was induced to activate; (4) Plating until the plating solution was tumbling: the plating time was 4 hours, and the pH value of the plating solution was adjusted with 1:5 ammonia water, and the pH value was adjusted to 4.8 until There is a tumb...

Embodiment 3

[0028] A method for chemically plating Ni-P alloy on the surface of diamond particles, comprising: (1) configuring plating solution: preparing the required plating solution for chemically plating Ni-P alloy in proportion, and the formula of said plating solution is nickel sulfate 40g / L, Sodium hypophosphite 30g / L, citric acid 30g / L, sodium acetate 25g / L, potassium iodate 0.05mg / L, sodium dodecylbenzenesulfonate 0.05mg / L; The plating tank with the prepared plating solution is heated in a constant temperature water bath, and the plating temperature is 90°C; (3) Add diamond particles and stir: directly add the weighed diamond particles into the above plating solution, use the plated A glass rod with Ni-P alloy was used to induce activation; (4) Plating until the plating solution was tumbling: the plating time was 5 hours, and the pH value of the plating solution was adjusted with 1:5 ammonia water, and the pH value was adjusted to 5.0 until the plating solution There is a tumblin...

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Abstract

The invention discloses a method for chemically plating a Ni-P alloy on surfaces of diamond particles. The method for chemically plating the Ni-P alloy on the surfaces of the diamond particles comprises the following steps: directly adding weighed diamond particles into a chemically plating Ni-P alloy solution; using a glass rod which is plated with the alloy for inducing and activating a chemically plating solution in a constant temperature water bath; or adding iron pieces which are plated with the alloy for the induction and the activation until occurring a boiling phenomenon; finishing the plating; obtaining the diamond particles plated with the Ni-P alloy element layer by means of precipitating, filtering, drying, and the like. The particles can be used as particle reinforcements for preparing metal-base composite materials. Meanwhile, the particles are a basic raw material for preparing engineering materials and functional materials.

Description

technical field [0001] The invention relates to the technical field of nanoparticle surface treatment, in particular to a method for chemically plating Ni-P alloy on the surface of diamond particles. Background technique [0002] At present, diamond particles are widely used as particle reinforcements to prepare metal matrix composites, and are also the basic raw materials for the preparation of engineering materials and functional materials. Many scholars at home and abroad are actively working on the application research of diamond particles. In practical applications, it is found that if bare diamond particles are directly added to the metal matrix to prepare reinforced composite materials, the interface wettability will be poor due to the essential difference between the covalent bonds of the diamond particles and the metal bonds of the metal matrix, and the diamond particles will When in contact with the metal matrix, a significant solid-phase reaction will occur at th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/36
CPCC23C18/36
Inventor 侯俊英高洪江
Owner QINGDAO UNIV OF SCI & TECH
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