Double-chip flip chip structure

Abstract

The invention provides a double-chip flip chip structure by taking a flip chip structure as a starting point. The double-chip flip chip structure is characterized in that a substrate with a central partition plate is provided with two chip slots in certain gradients, and a plurality of semispherical grooves are formed at contact positions of the slot slopes and chip conducting projections; each chip is provided with a plurality of cylindrical conducting projections with semispherical tops; an upper cooling fin is fastened to the top of the substrate. The double-chip flip chip structure has the advantages of realization of self-alignment chip bonding, realization of integral packaging of double chips, high integration level, reduction of chip packaging area and improvement of a heat radiation function.

Description

technical field [0001] The invention relates to the technical field of semiconductor device packaging, in particular to a double-chip flip-chip packaging structure. Background technique [0002] Flip Chip Interconnect Technology (Flip Chip Interconnect Technology), also known as "inverted chip packaging" or "inverted chip packaging method", is a kind of chip packaging technology. This packaging technology is to arrange the conductive bumps on the active surface of the chip, and flip chip bonding on the substrate, so that the chip can be electrically connected to the substrate through the conductive bumps, and electrically connected to the outside through the internal circuit of the substrate. electronic device. Flip-chip bonding technology is suitable for high-pin-count chip packaging structures, and has the advantages of reducing chip packaging area and shortening signal transmission paths. Flip-chip bonding technology has been widely used in the field of chip packaging. ...

AI Technical Summary

Problems solved by technology

The current stackable flip crystal has been proposed, but this structure has many disadvantages, which is no

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