Coating device and coating method

Abstract

The disclosure provides a coating device and a coating method. The coating device is used for coating viscous ink on a substrate to form a film. The substrate includes two opposite mounting surfaces. The coating device comprising: an accommodating mechanism, a coating mechanism and a forming mechanism. The coating mechanism includes two coating units. Each coating unit includes a rotatable filling roller for filling with pressure the viscous ink in the hole on the corresponding mounting surface to form an initial layer. The forming mechanism is used for scraping the initial layer covering on the mounting surfaces to form the film. The method of coating and then adjusting the thickness of the film may improve the quality of the products. By using the above disclosure, the production line can be simplified to lower the device costs, and the manufacturing time can be reduced to improve the manufacturing efficiency.

Description

technical field [0001] The invention relates to a coating device and a coating method, in particular to a coating device and a coating method for coating viscous ink on a base material in the process of manufacturing a flexible printed circuit board. Background technique [0002] Generally, the manufacturing of a flexible printed circuit board (FPCB for short) usually needs to go through processes such as photoresist coating, exposure, development, etching, ink coating and baking. Among them, as far as the process of coating ink is concerned, ink is usually coated on a substrate by a coating device to coat and form a film layer. The aforementioned film layer can provide insulation protection and protect copper wires from electrons. Parts are soldered to incorrect places. [0003] refer to figure 1 , a kind of coating equipment 91 that Chinese Taiwan Patent Certificate No. M418024 new patent discloses, comprises a base 911 that ink material 99 is housed, a coating roller un...

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Problems solved by technology

[0005] However, in the actual application of the aforementioned two kinds of coating equipment, since the surface of the substrate is usually provided with lines, the installation surface is uneven and blind holes or through holes are formed.

Therefore, when the aforementioned two kinds of coating devices apply a quantitative amount of ink to one of the setting surfaces of the substrate, because the amount of ink is fixed, when part of the ink is filled into the blind hole or When it is in the through hole, it will cause holes and discontinuity in the film layer covering the blind hole or near the through hole

In addition, the above two methods of coating equipment only apply the ink to the installation surface of the substrate. If the ink used has a high viscosity and low fluidity, the ink may not be completely filled on the above-mentioned surface. Blind holes or through holes, resulting in air bubbles between the prepared film layer and the substrate, thereby reducing product quality and aesthetics

[0006] More importantly, the aforementioned two kinds of coating equipment can only coat the ink on one of the setting surfaces of the substrate in a single process. When coating ink, after coating one of the setting surfaces, it is often necessary to roll up the substrate before using the coating equipment to coat the other setting surface

The manufacturing method of the above-mentioned two processes not only reduces the manufacturing efficiency due to the long working time, but also requires more and more complicated equipment components for the aforementioned manufacturing method, thereby increasing the equipment cost

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